General Purpose IO IP, BOAC (Bonding Over Active Circuit), UMC 0.18um G2 process
Overview
UMC 0.18um GII Logic process, BOAC Generic IO.
Technical Specifications
Short description
General Purpose IO IP, BOAC (Bonding Over Active Circuit), UMC 0.18um G2 process
Vendor
Vendor Name
Foundry, Node
UMC 180nm G2
UMC
Pre-Silicon:
180nm
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