Bluetooth low energy v5.4 Baseband Controller, Protocol Software Stack and Profiles IP

Overview

This Software and Silicon IP solutions, feature Bluetooth v5.4 capabilities including a certified Link-layer controller, Digital PHY, Stack & Profiles.
Endorsed by the Bluetooth Special Interest Group (SIG) for meeting version 5.3 specifications in Bluetooth low energy single mode, our v5.3 (Milan) Specifications enable Audio-over-BLE functionality, incorporating core Protocol Stack and Link Layer specifications.
In collaboration with Bluetooth SIG Working Groups, we're defining Generic Audio Middleware Specifications, exclusively designed to enable Audio-over-BLE. Our IP seamlessly integrates with third-party radios of leading Tier-1 customers, ensuring unparalleled compatibility and ease of adoption.

Key Features

  • Implements Link layer and physical layer of LE controller specification
  • v5.1 Madrid Features: DF - AoA/AoD
  • Firmware portable for 8/16/32-bit microcontrollers
  • Support for multiple processor bus and flexible RF
  • Interoperability tested at last few UPFs
  • Optimized SBC, mSBC and LC3 codecs
  • Platform and OS agnostic
  • OS and MCU abstraction layers for portability to any SoC platform
  • HW/FW co-design
  • Supports all mandatory and optional features
  • Supports all device roles and states
  • Architected for very low power and low footprint
  • Integrated Power Management Interface
  • BQB qualified

Benefits

  • BT SIG has licensed our stack for integration into the PTS -Test tool. This ensures that every product will need to prove interoperability against the partner's stack for the purpose of qualification
  • Proven in all UnPlugFests
  • Tested for interoperability with more than 200 smart phone models

Block Diagram

Bluetooth low energy v5.4 Baseband Controller, Protocol Software Stack and Profiles IP Block Diagram

Applications

  • TWS Earbuds
  • Bluetooth Headphones
  • Smart Speakers

Deliverables

  • Source Code of Transport Abstraction Layer and Operating System Abstraction Layer
  • Firmware source code
  • Technical Documentation
  • Support for multiple processor bus and flexible RF Interface

Technical Specifications

Maturity
In Production
Availability
Immediate
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Semiconductor IP