USB Audio Device Class 3.0 IP
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USB 4.0 - Enables fast data transfer, efficient power delivery, and connectivity
- USB 4.0 is the third major revision of the USB standard, offering data transfer speeds up to 20 Gbps via dual-lane operation. It supports multiple transfer modes and improved bandwidth utilization for high-speed applications.
- USB 4.0 enables seamless connectivity across various devices, from storage and printers to high-performance audio and video equipment. It enhances power delivery and ensures efficient data transfer for consumer electronics, networking, and industrial applications.
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USB PD Synthesizable Transactor
- USB PD Features
- Supports USB Power Delivery Specification 3.1,3.0, 2.0 and 1.0
- Supports USB Type-C Cable and Connector Specification
- Supports Cable plug communication
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USB 2.0 picoPHY in GF (40nm, 28nm)
- Complete mixed-signal physical layer for single-chip USB 2.0 OTG and non-OTG applications
- Small PHY macro area
- Low power
- Advanced power management features, including support for power supply gating, supply scaling, ultra-low standby current support, and power management unit (PMU) interrupt support
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USB 2.0 femtoPHY in GF (28nm, 22nm, 12nm)
- Complete mixed-signal physical layer for single-chip USB 2.0 Host, Device, and Dual Role applications Small PHY macro area: as small as 0.20 mm2
- Low power: as low as 50mW (during high-speed packet transmission)
- Advanced power management features including support for power supply gating, supply scaling, ultra-low standby current support, and power management unit (PMU) interrupt support
- Supports USB 2.0 ID-pin detection and OTG Voltage Detectors
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USB 2.0 femtoPHY in GF (22nm) for Automotive Grade 1
- Complete mixed-signal physical layer for single-chip USB 2.0 Host, Device, and Dual Role applications Small PHY macro area: as small as 0.20 mm2
- Low power: as low as 50mW (during high-speed packet transmission)
- Advanced power management features including support for power supply gating, supply scaling, ultra-low standby current support, and power management unit (PMU) interrupt support
- Supports USB 2.0 ID-pin detection and OTG Voltage Detectors
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USB 2.0 femtoPHY in TSMC (16nm, N7) for Automotive
- Complete mixed-signal physical layer for single-chip USB 2.0 Host, Device, and Dual Role applications Small PHY macro area: as small as 0.20 mm2
- Low power: as low as 50mW (during high-speed packet transmission)
- Advanced power management features including support for power supply gating, supply scaling, ultra-low standby current support, and power management unit (PMU) interrupt support
- Supports USB 2.0 ID-pin detection and OTG Voltage Detectors
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24bit Audio CODEC in 130nm~14nm
- ? DAC SNR 93dB (‘A’ weighted), THD –87dB at 48kHz, 2.5V
- ? ADC SNR 91dB (‘A’ weighted), THD -81dB at 48kHz, 2.5V
- ? Programmable ALC / Noise Gate
- ? 2x On-chip Headphone Drivers
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USB 2.0 picoPHY in UMC (40nm, 28nm)
- Complete mixed-signal physical layer for single-chip USB 2.0 OTG and non-OTG applications
- Small PHY macro area
- Low power
- Advanced power management features, including support for power supply gating, supply scaling, ultra-low standby current support, and power management unit (PMU) interrupt support
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USB 2.0 picoPHY in TSMC (40nm, 28nm)
- Complete mixed-signal physical layer for single-chip USB 2.0 OTG and non-OTG applications
- Small PHY macro area
- Low power
- Advanced power management features, including support for power supply gating, supply scaling, ultra-low standby current support, and power management unit (PMU) interrupt support
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USB 2.0 femtoPHY in Samsung (14nm, 11nm, 8nm, 7nm, 5nm, SF4X)
- Designed for advanced 1.8V CMOS planar bulk and FinFET process nodes