AMBA CHI C2C IP
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17
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UCIe-S PHY for Standard Package (x16) in TSMC N6, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S PHY for Standard Package (x16) in TSMC N5A, N/S, for Automotive, ASIL B Random, AEC-Q100 Grade 2
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S PHY for Standard Package (x16) in TSMC N5, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-A PHY for Advanced Package (x64) in TSMC N5, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-A PHY for Advanced Package (x64) in TSMC N5, East/West Orientation with 8collumn module configuration
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S PHY for Standard Package (x16) in TSMC N4P, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-A PHY for Advanced Package (x64) in TSMC N3E, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S PHY for Standard Package (x32) in TSMC N3P, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-S PHY for Standard Package (x16) in SS SF4X, North/South Orientation
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
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UCIe-A PHY for Advanced Package (x64) in SS SF4X, North/South Orientation with 8collumn module configuration
- Supports data rates up to 40Gb/s and bandwidth density of 12.9Tbps/mm
- Compliant with the latest UCIe specification
- Integrated signal integrity monitors and comprehensive test and repair features
- Supports high-density advanced packaging technologies such as silicon interposer, silicon bridge, and RDL fanout
