Specialty OSC IO IP, BOAC (Bonding Over Active Circuit), UMC 90nm SP process
Overview
UMC 90nm SP/RVT Logic Low-K process 2.5V OD 3.3V high frequency OSC Pad.
Technical Specifications
Short description
Specialty OSC IO IP, BOAC (Bonding Over Active Circuit), UMC 90nm SP process
Vendor
Vendor Name
Foundry, Node
UMC 90nm SP
UMC
Pre-Silicon:
90nm
SP
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