Broadcom Enables Industry's First 20 nm 100G Coherent PHY
NTT Electronics Leverages Broadcom's Analog IP and Process Technology to Drive Next Generation Coherent Pluggable Optical Modules
IRVINE, Calif., Sept. 22, 2014 -- Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced that its high performance 20 nanometer (nm) signal processing enhanced mixed signal technologies has enabled NTT Electronics' new NLD0640 100G coherent digital signal processor (DSP) — an industry first. Optimized for use in 100G-and-beyond optical fiber communication systems, the Broadcom-enabled coherent physical layer transceiver (PHY) consumes less than half the power of existing long-haul coherent ICs and expands the use of coherent technology to metro and shorter reach links.
Designed in collaboration with NTT Electronics (NEL), the low-power 100G coherent PHY allows the use of a DSP within lower power and smaller second generation coherent 100G modules, including C form factor pluggable (CFP) and compact CFP2 analog coherent optical (ACO) modules. Featuring Broadcom's best-in-class 65GS/s 8-bit ADC and DAC IP with advanced features such as digital signal enhanced performance, NEL's 100G coherent PHY optimizes power and performance in both long-haul and metro applications.
According to industry analyst firm Infonetics Research, the demand for 100G optical transceivers is growing rapidly as carriers aggressively roll out the new technology. Infonetics predicts that over the next few years, short and intermediate metro reach interfaces will make up a larger proportion of revenue as the technology moves from service provider to much higher volume data center and enterprise applications.1
The exponential increase in design complexity in today's system-on-a-chip (SoC) solutions combined with product differentiation and time-to-market pressures has led OEM manufacturers to rely on Broadcom's custom IC services. Leveraging one of the most extensive networking, mixed signal, and high speed interface IP portfolios and proven time-tested design methodology, Broadcom provides a more reliable path to production, thus avoiding costly multiple chip spins and/or schedule delays.
"Our collaboration with NTT Electronics has resulted in a game-changing product optimized to deliver the economies of scale and flexibility needed for wide-scale adoption and rapid deployment of 100G over fiber optic networks," said Lorenzo Longo, Broadcom Vice President and General Manager, Physical Layer Products. "Our industry leading 20-nm signal processing enhanced mixed-signal technologies and A0 silicon execution has allowed NEL to substantially reduce power consumption while meeting stringent time to market requirements."
"We are strongly committed to pioneering innovation in the coherent DSP market through our robust partnership with Broadcom," said Haruhiko Ichino, NEL Executive Vice President and General Manager of Broadband System & Device Business Group. "Our novel LP-DSP has already been shipped to more than ten customers, who are designing their product families. We look forward to deployment of our product in early 2015 thereby providing value to the end customers by maximizing the number of 100G ports per system."
Availability
The NLD0640 100G coherent DSP is now available from NTT Electronics.
Resources
1 Infonetics 10G/40G/100G Optical Transceivers: WW Market Size and Forecasts Oct 2013.
About Broadcom
Broadcom Corporation (NASDAQ: BRCM), a FORTUNE 500® company, is a global leader and innovator in semiconductor solutions for wired and wireless communications. Broadcom® products seamlessly deliver voice, video, data and multimedia connectivity in the home, office and mobile environments. With the industry's broadest portfolio of state-of-the-art system-on-a-chip solutions, Broadcom is changing the world by connecting everything®. For more information, go to www.broadcom.com.
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related News
- Broadcom sees rising 20 nm costs amid handset push
- ArterisIP Advances Machine Learning SoC Design with Ncore 2.0 Cache Coherent Interconnect and Resilience Package
- GOWIN Semiconductor USB 2.0 PHY Interface and Device Controller IPs Achieve USB-IF Certification
- HDMI 2.0 Tx PHY in 12FFC along with Controller IP Core with high lossless Audio/Video data transfer, licensed for a 4KTV SoC
Latest News
- How hardware-assisted verification (HAV) transforms EDA workflows
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology