Doing Moore with Less
It’s a common refrain, and I heard it this week at the IEEE VLSI Test Symposium in Santa Cruz: Moore’s Law is increasingly difficult to obey. We see evidence of this perception everywhere:
- Manufacturing costs are soaring: A fab that cost $2.5 billion to construction at 90 nm now costs $6 billion at the 22 nm node. So companies are selling off their fabs and losing what was once a huge competitive differentiation for them. Their primary differentiation is increasing their product-development capability.
- System-on-Chip (SOC) development costs run anywhere from $50 million to $100 million per project. A dwindling number of markets can support the ROI that type of investment demands.
This increasing risk has significantly cooled VC investment in our industry. In 2000, venture capitalists invested nearly $4 billion in semiconductor companies; last year, it was $771 million.
This means that to be successful in 2010 and beyond, semiconductor companies must “do Moore” with less. That requires a focus on product-development capability. How do you transform your product-development organization into a world-class team?
To read the full article, click here
Related Semiconductor IP
- 0.9V/2.5V I/O Library in TSMC 55nm
- 1.8V/3.3V Multi-Voltage GPIO in TSMC 28nm
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- ESD Solutions for Multi-Gigabit SerDes in TSMC 28nm
- High-Speed 3.3V I/O library with 8kV ESD Protection in TSPCo 65nm
Latest Blogs
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms
- ReRAM-Powered Edge AI: A Game-Changer for Energy Efficiency, Cost, and Security