Arm Musca-B1 test chip leads the way to develop secure IoT chip designs faster
You may already know the Arm Musca-A, the first Platform Security Architecture (PSA) development platform with an Arm Cortex-M33 based subsystem, Arm TrustZone and reference architecture for Arm TrustZone-based systems. The board is a great tool to evaluate the IP and develop more secure software , so it’s no surprise that has been very popular amongst developers, with many design partners across the whole ecosystem using it as a reference to develop secure IoT chip designs.
We’re pleased to introduce our new board for the development of PSA ready IoT subsystems for Cortex-M, Musca-B1. Along with the elements of Musca-A, Musca-B1 has added Arm CryptoIsland and eFlash features for increased security assurance when it is needed. Security improvements are being driven by the risk of damaged reputations and the potential costs of any critical failure. Embedded systems increasingly have to manage sensitive data and applications such as payment services. With hacking on the increase, the natural concern is to address security as a system level concern.
To read the full article, click here
Related Semiconductor IP
- Ultra-low leakage I/O Library in TSMC 22nm
- Three-Speed Inline Library with Open Drain I/0 in TSMC 22nm
- 1.8V/3.3V Switchable GPIO in TSMC 28nm
- GF12 - 0.8V LVDS Rad-Hard Transceiver in GF 12nm
- GF12 - 0.8V SLVS Rad-Hard Transceiver in GF 12nm
Related Blogs
- Arm Musca-B1 test chip leads the way to develop secure IoT chip designs faster
- The Age of AI Demands Faster Chip Development: Only Arm and Cadence Deliver
- Introducing Industry's-First 28FDS eMRAM IoT Test Chip and Board
- Synopsys and Intel Team Up on the First UCIe-Connected Chiplet-Based Test Chip
Latest Blogs
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms
- ReRAM-Powered Edge AI: A Game-Changer for Energy Efficiency, Cost, and Security
- Ceva-XC21 and Ceva-XC23 DSPs: Advancing Wireless and Edge AI Processing
- Cadence Silicon Success of UCIe IP on Samsung Foundry’s 5nm Automotive Process
- Empowering your Embedded AI with 22FDX+