The Innosilicon PCIe3.0 PHY is a highly configurable PHY capable of supporting speeds up to 8Gbps within a single lane. For this particular datasheet, the PHY has been configured to support PCIe3.0 specifically, but the PHY itself can be configured to support a wide range of HS SERDES protocols through changes to the PCS layer and register settings.
The PHY is physically configured in order to support multi-lane solutions. There is a common block with Tx PLL, reference clock input, bandgap, bias circuitry and termination calibration. This common block can then support up to 4 lanes of Tx/Rx.
PCIe3.0 PHY
Overview
Key Features
- Reference Clock:
- 25-300MHz, integer multiple of Serial output
- +/-300ppm frequency stability (<20Gbps)
- Support both SRNS & SRIS modes
- Configurable as reference clock repeater
- Internal PLL:
- Used to drive all PHY transmitters and receivers
- Ring PLL covering 1.0-8.0Gbps
- Programmable pre-divider & feedback divider
- Initiative SSC or reference clock based passive SSC
- LOCK indication
- Data Transmit:
- Rates supported from 1.0-8.0Gbps
- AC coupled
- 50? impedance, internally calibrated
- 3 tap pre/post-cursor de-emphasis, programmable
- 200-1000mV differential peak-peak, programmable
- Programmable Rise/Fall times
- Data Receive:
- AC coupled
- 50? impedance, internally calibrated
- 200-1200mV differential peak-peak
- CTLE, programmable
- DFE, 6-tap programmable
- CDR
- Testing:
- Scan
- BIST with PRBS7, PRBS23 and PRBS31(PG & SD)
- Loopback (near-end, far-end, on/off-die)
- On-chip scope (eye height & width)
- Analog and digital probe points
- HTOL
- IDDQ
- ESD:
- HBM 2000V, [JEDEC JS-001-2014]
- MM100V, [JEDEC JESD22-A115C]
- CDM 250V, [JEDEC JESD22-C101F]
- Latch Up:
- +-200mA for IO and 1.5*Vsupply for power rails
- Package:
- Wire bond with careful SI/PI analysis for 8Gbps and below
- Flip-Chip with careful SI/PI analysis for 8Gbps and up
- Interface with controller:
- PIPE4.3 & 32 bits data bus for PCIe and USB3.x
Benefits
- Standard PHY interface enables multiple IP sources for PCI Express Logical Layer and provides a target interface for PCI Express PHY vendors.
- Supports 2.5/5.0Gb/s serial data transmission rate
- Utilizes a 16-bit or 32-bit interface to transmit and receive PCI Express data
- Allows integration of high speed components into a single functional block.
- Data and clock recovery from serial stream on the PCI Express bus
- Holding registers to stage transmit and receive data
- Supports direct disparity control for use in transmitting compliance pattern
- 8b/10b encode/decode and error indication
- Receiver detection
- Beacon transmission and reception
- Selectable Tx Margining, FFE and signal swing values
- Built in self-test and loopback test
- Selectable Tx Margining and FFE taps
- Selectable Rx CTLE peaking range and DFE taps
- Auto calibrated and tunable on die termination (ODT)
- Integrated IO with ESD protection aimed at HBM 2KV, MM 100V and CDM 250V
- Well-tuned T-coil to promote ultra-high bandwidth
Deliverables
- Verilog Sim Behavioral simulation model for the PHY
- Encrypted IO spice netlist for SI evaluation
- Integration Guidelines
- Test Guidelines
- GDSII Layout and layer map for foundry merge
- Place and Route LIB and LEF views for the AFE
- LVS and DRC verification reports
Technical Specifications
Foundry, Node
SMIC 40nm, TSMC 22nm
SMIC
In Production:
28nm
Silicon Proven: 28nm
Silicon Proven: 28nm
TSMC
In Production:
22nm
Silicon Proven: 22nm
Silicon Proven: 22nm
Related IPs
- Single Lane and Quad Lane 8Gbps PCIe3.0 PHY IP in TSMC 28HPC process
- Single Lane and Quad Lane 8Gbps PCIe3.0 PHY IP in GF 28SLP process
- Single Lane and Quad Lane 8Gbps PCIe3.0 PHY in Samsung 28LPP process
- Single Lane and Quad Lane 8Gbps PCIe3.0 PHY IP in TSMC 65G process
- UCIe-S PHY for Standard Package (x16) in TSMC N3E, North/South Orientation
- LPDDR5X/5/4X PHY - TSMC N5A for Automotive, ASIL B Random, AEC-Q100 Grade 2