MIPI C/D-PHY TX

Overview

The Innosilicon MIPI C/D PHY TX integrates a MIPI C-PHY and a MIPI D-PHY in a single IP core, which provides a MIPI high speed data plus low-power low speed transmitter that supports data transfer in the bi-directional mode.
? The D-PHY is built in with a standard digital interface to talk to any third-party host controllers.
? The C-PHY is designed to coexist on the same IC pins as D-PHY so that dual-mode devices could be developed with low power signaling similar to D-PHY.
The D-PHY and C-PHY support the electrical portion of MIPI D-PHY V1.2 standard and MIPI C-PHY V1.1 standard, covering all transmission modes (ULP/LP/HS). Innosilicon MIPI C/D PHY TX enables a seamless implementation allowing interfaces to D-PHY based sensors or C-PHY based sensors. This IP cost-effectively adds MIPI D-PHY and MIPI C-PHY capability to any SoC used in communication and consumer electronics field.
The Innosilicon I/O and ESD are also built-in as one in a rectangular footprint for any configuration. It is optimized for high-speed applications with robust timing and small silicon area.

Key Features

  • Analog mixed-signal hard-macro HS/LP transmitter solution
  • Compliant with MIPI® Alliance Specification for D-PHY V1.2
  • Compliant with MIPI® Alliance Specification for C-PHY V1.1
  • Integrated PHY Protocol Interface (PPI) supports interfaces to CSI, DSI and UniPro™ MIPI® protocols
  • HS, LP, ULPS modes supported
  • 2.5Gbps maximum data transfer rate per lane on D-PHY mode
  • 2.5Gsps maximum data transfer rate per trio on C-PHY mode
  • Asynchronous transfer at low power mode with a bit rate of 10Mbps on both C-PHY and D-PHY
  • Unidirectional and bi-directional modes supported
  • Skew-calibration for D-PHY supported
  • ECC and CRC insertion supported
  • Automatic termination control for HS and LP modes
  • Buffers with tunable on-die-termination and advanced equalization
  • Embedded bump pads
  • Supports PHY BIST logic

Deliverables

  • Databook and detailed physical implementation guides for the complete PHY
  • Library Exchange Format (LEF) file with pin size and locations
  • Gate-level netlist and Standard Delay Format (SDF) Timing file
  • Layout Versus Schematic (LVS) flattened netlist in spice format and report
  • Encrypted Verilog Models
  • GDSII database for foundry merge
  • Module integration guidelines
  • Silicon validation report (when available)
  • Evaluation board (when available)

Technical Specifications

Foundry, Node
Samsung 5nm, TSMC 6/3nm, GF 14/12nm, SMIC 14nm
GLOBALFOUNDRIES
In Production: 12nm , 14nm LPP
Silicon Proven: 12nm , 14nm LPP
SMIC
In Production: 14nm
Silicon Proven: 14nm
Samsung
In Production: 5nm
Silicon Proven: 5nm
TSMC
In Production: 3nm , 6nm
Silicon Proven: 3nm , 6nm
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Semiconductor IP