A 55nm Wirebond IO library with 1-3.3V GPIO, 3.3V pulse-width modulation cell, I2C & SVID open-drain cells, 3.3V & 5V analog cells, OTP program cell & associated ESD
Key attributes of this IO library include dual independent IO supply rails (1.0V-3.3V & 3.3V) and power-on-control (POC) to place IOs in HiZ during power-down. The GPIO cell can be configured as input, output or open-drain with a Schmitt trigger input and optional internal 55K ohm pull-up or pull-down resistor. Cells for two independent IO supplies, core power, ground and isolated ground with built-in ESD are included. A specialty output cell with matched throughput timings for pulse-width modulation (PWM) applications, along with 5V OTP programming, I2C & SVID open-drain and 3.3V & 5V analog cells (and associated ESD) complement the GPIO offering. The library is enriched with filler, corner, and domain-break cells in digital and analog domains, allowing for flexible pad ring construction. ESD design levels are 2KV HBM and 500V CDM
1.0-3.3V GPIO With I2C Open Drain And 3.3V & 5V Analog Cells in 55nm
Overview
Key Features
- 1.0V-3.3V | 3.3V IO operation
- Dual independent IO rails
- Output enable / disable (HiZ when disabled)
- Power-down control (HiZ upon VDD disable)
- Schmitt trigger receiver
- 55K? selectable pull-up or pull-down resistor
- ESD: 2KV HBM, 500V CDM
- Silicon proven
Block Diagram
Technical Specifications
Foundry, Node
TSMC 55nm
TSMC
Silicon Proven:
55nm
G
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