Which Direction for EDA - 2D, 3D, or 360?

By _harry ... the ASIC guy

May 24, 2010

There’s been lots of discussion over the last month or 2 about the direction of EDA going forward. And I mean literally, the “direction” of EDA. Many semiconductor industry folks and proponents have been telling us to hold off on that obituary for 2D scaling and Moore’s law. Others have been doing quiet innovation in the technologies needed for 3D die and wafer stacks. And Cadence has recently unveiled its holistic 360 degree vision for EDA that has us developing apps first and silicon last.

I’ll examine each of these orthogonal directions in the next few posts. In this post, I’ll first examine the problem that is forcing us to make these choices.

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