Get to Market Faster Using Arm Comprehensive Physical and POP IP Platform on Samsung Foundry 5nm Technology
The explosive growth of applications such as 5G, High Performance Compute (HPC), augmented and virtual reality (AR and VR), automotive, and IoT demands the best possible power, performance and area (PPA), low cost, high reliability, and a quick design cycle. As a result, SoC designs for these applications become more complex and demand more functionality, less power consumption and fewer faults. Optimal implementation can be achieved only when the design components and the manufacturing process are optimized together, and when designers can extract the best out of the IP with the process to bring the best products to market.
Advances in semiconductor manufacturing with technologies such as extreme ultraviolet (EUV) lithography help meet the market demands by permitting the complex functionality in a small form factor. In addition, EUV enables designs to continue pushing performance while keeping power under control.
To read the full article, click here
Related Semiconductor IP
- SoC Security Platform / Hardware Root of Trust
- SPI to AHB-Lite Bridge
- Octal SPI Master/Slave Controller
- I2C and SPI Master/Slave Controller
- AHB/AXI4-Lite to AXI4-Stream Bridge
Related Blogs
- Samsung is NOT a Foundry!
- Using Physical USB Devices with the Xilinx Zynq-7000 Virtual Platform
- 2016 Samsung Foundry Update!
- Intel licenses ARM physical IP for foundry customers