Slow India may lose Cricket wafer fab
By Peter Clarke, EETimes Europe
January 31, 2017
Cricket Semiconductor, an analog and power pure-play foundry project that was being prepared for touch down in India, is running late and could end up being constructed in a different country.
The plan, announced in 2015, was for Cricket to break ground for an analog and power circuit wafer fab in 2016 – with Indore in Madhya Pradesh as the likely location – and that it would begin producing chips in 2018.
"The project has taken longer than we had anticipated, and it may continue to move at a pace that is slower than our preference," Lou Hutter, a former Texas Instruments executive working on the project, said in email correspondence with EE Times Europe.
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related News
- SMIC Shanghai Starts Construction of a New 12-Inch Wafer Fab
- Taiwan Maintains Largest Share of Global IC Wafer Fab Capacity
- Taiwan Maintains The Largest Share of Global IC Wafer Fab Capacity
- India Doesn't Need Its Own Fab
Latest News
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology
- Arm Announces Appointment of Eric Hayes as Executive Vice President, Operations