Innosilicon CSI-2 Receiver implements CSI-2 protocol and MIPI D-PHY protocol. The CSI-2 link protocol specification is a part of group of communication protocols defined by MIPI Alliance standards intended for mobile system chip to chip communications. The CSI-2 specification is specially targets for Camera to Image application processor communication.
Innosilicon CSI-2 Receiver operates as a receiver of a CSI-2 link, which consists of an Innosilicon D-PHY and an Innosilicon CSI-2 controller.
? The Innosilicon D-PHY is used for the data transmission from a CSI-2 compliant camera sensor. In D-PHY, data stream is transmitted as packets. Error information is generated for application layer to do further operation.
? The Innosilicon MIPI CSI-2 Receiver Controller works as a protocol layer between application layer and physical layer. It implements all three layers defined by CSI-2 Specifications and aims to reconstruct the data stream from the D-PHY.
MIPI CSI-2 TX IP
Overview
Key Features
- Compliant with MIPI Alliance Standard for Camera Serial Interface 2 (CSI-2) V1.3
- Compliant with MIPI Alliance Standard for D-PHY Specifications V1.2
- Integrated PHY Protocol Interface (PPI) interfaces to CSI-2 and UniPro™ MIPI® protocols
- HS, LP and ULPS modes supported
- 1.2Gbps maximum data transfer rate per lane (D-PHY)
- 32-bit Image Data Interface delivering data formatted as recommended in CSI-2 specification.
- Implements all three CSI-2 MIPI Layers (Pixel/Byte Packing Layer, Low Level Protocol and Lane Management)
- Supports high speed and low power lane operation
- Supports data type: RGB/YUV/RAW (Based on actual application scenarios)
- Supports virtual channel
- Supports for D-PHY Ultra Low Power State
- Error detection and correction supported
- Dynamic configuration and control via core ports
Deliverables
- Databook and physical implementation guides Netlist (Spice format for LVS)
- Library Exchange Format (LEF)
- Encrypted Verilog Models
- GDSII to Foundry IP Merge
- Module integration guidelines
- Silicon validation report (when available)
- Evaluation board (when available)
Technical Specifications
Foundry, Node
SMIC 14nm, GF 14/12nm
GLOBALFOUNDRIES
In Production:
12nm
,
14nm
LPP
Silicon Proven: 12nm , 14nm LPP
Silicon Proven: 12nm , 14nm LPP
SMIC
In Production:
14nm
,
110nm
G
Silicon Proven: 14nm , 110nm G
Silicon Proven: 14nm , 110nm G
TSMC
In Production:
3nm
Silicon Proven: 3nm
Silicon Proven: 3nm
Related IPs
- MIPI RFFE Slave IP Core
- MIPI DPHY v1.2 TX 2 Lanes - TSMC 12FFCP 1.8V, North/South Poly Orientation
- MIPI DPHY v1.2 TX 2 Lanes - TSMC 16FFC 1.8V, N/S, for Automotive, ASIL B Random, AEC-Q100 Grade 2
- MIPI DPHY v1.2 TX 2 Lanes - TSMC 16FFC 1.8V, North/South Poly Orientation
- MIPI DPHY v1.2 TX 4 Lanes - TSMC 16FFC 1.8V, North/South Poly Orientation
- MIPI D-PHY Tx 4 Lanes - TSMC 16FFC18, North/South Poly Orientation for Automotive, ASIL B Random, AEC-Q100 Grade 2