Innosilicon LVDS implements LVDS TIA/EIA protocol. It specifies a low-voltage point-to-point signal interface, which uses a differential driver connected to a terminated receiver through a constant-impedance transmission line. Normally, Innosilicon LVDS contains serial-to-parallel logic, PLL and register bank. It can be configured by registers through APB bus.
In addition, Innosilicon LVDS could extend from 5 lanes to N lanes (N is required by the customer). Therefore, the TTL lines extend respectively.
LVDS TX PHY & Controller
Overview
Key Features
- Compatible with 900mV Vcom sub-LVDS standard
- LVDS Display Serdes Interfaces directly to LCD Display Panels with Integrated LVDS
- Suited for Display Resolutions Ranging from HVGA up to HD with Low EMI
- Supports 4 data lanes and 1 clock lane mode, the data lane is extended according to customers.
- Meet or exceed the requirements of 900mV Vcom sub-LVDS standard
- Supports byte clock for LVDS mode
- Supports the input signals clock edge and data edge align
- Supports 7-bit parallel output per data lane in LVDS mode
- Supports data rate up to 1.2Gbps per lane for LVDS mode
- Typical input Impedance 100?
- Dual channels supported
- BIST with built-in PRBS
- Embedded ESD, boundary scan support logic
Deliverables
- Databook and physical implementation guides Netlist (Spice format for LVS)
- Library Exchange Format (LEF)
- Encrypted Verilog Models
- GDSII to Foundry IP Merge
- Module integration guidelines
- Silicon validation report (when available)
- Evaluation board (when available)
Technical Specifications
Foundry, Node
SMIC 40/28/12nm, TSMC 28/22/16/12nm, Samsung 28/14nm
SMIC
In Production:
40nm
LL
Silicon Proven: 28nm HKC+
Silicon Proven: 28nm HKC+
Samsung
In Production:
14nm
Pre-Silicon: 28nm FDS , 28nm LPP
Pre-Silicon: 28nm FDS , 28nm LPP
TSMC
In Production:
12nm
,
16nm
Pre-Silicon: 28nm HPC , 28nm HPCP , 28nm HPM
Pre-Silicon: 28nm HPC , 28nm HPCP , 28nm HPM
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