2.5-D will be a market of its own
Ivo Bolsens, Xilinx
EETimes (2/22/2012 1:39 PM EST)
The IC industry is revving up efforts to make 2.5-D and eventually 3-D IC technology a mainstream reality.
The vision of a 3-D IC is promising, but some industry watchers believe the 2.5-D market to be more than a steppingstone to true 3-D design. They say 2.5-D technology has staying power. Leveraging it industrywide will require evolutionary, rather than revolutionary, adjustments to current design flows and the supply chain.
In its Virtex-7 2000T, Xilinx Inc. places several dice side by side on a passive silicon interposer. The 2.5-D technology has marked advantages in capacity, performance, form factor and system power consumption over traditional multichip implementations.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O Library with 5V ODIO & Analog in TSMC 16nm
- ESD Solutions for Multi-Gigabit SerDes in TSMC 28nm
- High-Speed 3.3V I/O library with 8kV ESD Protection in TSPCo 65nm
- Verification IP for DisplayPort/eDP
- Wirebond Digital and Analog Library in TSMC 65nm
Related White Papers
- 2.5D ICs are more than a stepping stone to 3D ICs
- How to get the best performance and utilization from Xilinx Virtex-5 FPGAs
- Designing with Virtex-5 Embedded Tri-Mode Ethernet MACs
- Designing FPGA Based Reliable Systems Using Virtex-5 System Monitor
Latest White Papers
- What tamper detection IP brings to SoC designs
- Analyzing Modern NVIDIA GPU cores
- RISC-V in 2025: Progress, Challenges,and What’s Next for Automotive & OpenHardware
- Leveraging RISC-V as a Unified, Heterogeneous Platform for Next-Gen AI Chips
- Design and implementation of a hardened cryptographic coprocessor for a RISC-V 128-bit core