ST's SPAD Imager Likely Linked to iPhone 8
Apple in Grenoble, ST's IEDM paper, $1B CapEx
Junko Yoshida, EETimes
3/21/2017 01:59 PM EDT
LYON, France — Apple’s upcoming iPhone 8 — allegedly featuring a “3D camera” — has been the subject of intense speculation among the media and the financial community for months.
The dots in this puzzle that have yet to be connected are the explicit relationships among the iPhone 8, single photon avalanche diodes (SPAD) and a company in Europe — STMicroelectronics.
Obviously, any connection that would identify Apple as an ST customer is one that ST wouldn't touch with a ten-foot diode. ST, ergo, is mum.
However, Yole Développement, a Lyon-based market research firm with strong focus on technology analysis, recently drew an almost unbroken line from dot to dot. Yole’s educated guess is that ST is bringing a brand new 3D (array) imager to Apple iPhone 8 — an innovation that will alter the phone’s user interface.
To read the full article, click here
Related Semiconductor IP
- Root of Trust (RoT)
- Fixed Point Doppler Channel IP core
- Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- Polyphase Video Scaler
- Compact, low-power, 8bit ADC on GF 22nm FDX
Related News
- Qualcomm, Samsung, Mediatek Offer Hints on iPhone 8
- iPhone 8 Still Packs Qualcomm, NXP
- SuperH names executives at RISC chip venture between Hitachi and STMicro
- Parthus and STMicro team on Bluetooth RF
Latest News
- How hardware-assisted verification (HAV) transforms EDA workflows
- BrainChip Provides Low-Power Neuromorphic Processing for Quantum Ventura’s Cyberthreat Intelligence Tool
- Ultra Accelerator Link Consortium (UALink) Welcomes Alibaba, Apple and Synopsys to Board of Directors
- CAST to Enter the Post-Quantum Cryptography Era with New KiviPQC-KEM IP Core
- InPsytech Announces Finalization of UCIe IP Design, Driving Breakthroughs in High-Speed Transmission Technology