25G Multi-SerDes PHY

Overview

The Innosilicon 25G SERDES PHY is a highly configurable PHY capable of supporting speeds up to 25Gbps within a single lane. For this particular datasheet, the PHY has been configured to support HMC-25G-VSR specifically, but the PHY itself can be configured to support a wide range of HS SERDES protocols through changes to the PCS layer and register settings.
The PHY is physically configured in order to support multi-lane solutions. There is a common block with Tx PLL, reference clock input, bandgap, bias circuitry and termination calibration. This common block can then support up to 4 lanes of Tx/Rx.

Key Features

  • Reference Clock:
    • 25-300MHz, integer multiple of Serial output
    • +/-300ppm frequency stability (<20Gbps)
    • +/-100ppm frequency stability (>=20Gbps)
    • Support both SRNS & SRIS modes
    • Configurable as reference clock repeater
  • Internal PLL:
    • Used to drive all PHY transmitters and receivers
    • LC-tank architecture operational from 16-25 Gbps
    • Ring PLL covering 1.0-16Gbps
    • Programmable pre-divider & feedback divider
    • Initiative SSC or reference clock based passive SSC
    • LOCK indication
  • Data Transmit:
    • Rates supported from 1.0-25 Gbps
    • AC coupled
    • 50? impedance, internally calibrated
    • 3 tap pre/post-cursor de-emphasis, programmable
    • 200-1000mV differential peak-peak, programmable
    • Programmable Rise/Fall times
  • Data Receive:
    • AC coupled
    • 50? impedance, internally calibrated
    • 200-1200mV differential peak-peak
    • CTLE, programmable
    • DFE, 6-tap programmable
    • CDR
  • Testing:
    • Scan
    • BIST with PRBS7, PRBS23 and PRBS31 (PG & SD)
    • Loopback (near-end, far-end, on/off-die)
    • On-chip scope (eye height & width)
    • Analog and digital probe points
    • HTOL
    • IDDQ
  • ESD:
    • HBM 2000V, [JEDEC JS-001-2014]
    • MM100V, [JEDEC JESD22-A115C]
    • CDM 250V, [JEDEC JESD22-C101F]
  • Latch Up: +-200mA for IO and 1.5*Vsupply for power rails
  • Package:
    • Wire bond with careful SI/PI analysis for 8Gbps and below
    • Flip-Chip with careful SI/PI analysis for 8Gbps and Up
  • Interface with controller:
    • PIPE4.3 & 32 bits data bus for PCIe and USB3.x
    • SAPIs for SATA3.0
    • UTMI+ (level3) 8/16bit for USB2.0 (as a separated IP not described in this document)
    • XGMII for XAUI/10GbE
    • Serdes interface for customized PCS

Benefits

  • As with all Innosilicon IP, the focus is on silicon proven, fully certified solutions providing:
  • Small size
  • Low power
  • High ATE coverage
  • Simple integration
  • Flexible customization

Deliverables

  • Verilog Sim Behavioral simulation model for the PHY
  • Encrypted IO spice netlist for SI evaluation
  • Integration Guidelines
  • Test Guidelines
  • GDSII Layout and layer map for foundry merge
  • Place and Route LIB and LEF views for the AFE
  • LVS and DRC verification reports

Technical Specifications

Foundry, Node
GF 28/22nm, UMC 28/22nm, TSMC 28/22nm, SMIC 28nm, Samsung 28nm, HLMC 28nm
Maturity
Silicon proven and validated
GLOBALFOUNDRIES
In Production: 22nm FDX , 28nm SLP
Pre-Silicon: 28nm SLP
Silicon Proven: 22nm FDX , 28nm SLP
SMIC
In Production: 28nm
Silicon Proven: 28nm
Samsung
In Production: 28nm FDS , 28nm LPP
Silicon Proven: 28nm FDS , 28nm LPP
TSMC
In Production: 22nm , 28nm HPC , 28nm HPCP , 28nm HPM
Silicon Proven: 22nm , 28nm HPC , 28nm HPCP , 28nm HPM
UMC
In Production: 22nm , 28nm HPC
Silicon Proven: 22nm , 28nm HPC
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Semiconductor IP