Semiconductor Memory Challenges Will Be Overcome, MemCon Keynoter Says
August 8, 2013
SANTA CLARA, Calif.--Just a few hundred yards from twisting and turning amusement park roller-coasters, Martin Lund took his audience on another thrill ride on Tuesday morning: a journey through the state of today's semiconductor memory business.
For decades, that semiconductor memory business--primarily DRAMs and SRAMs--was driven by one main application computing--primarily PC computing. Even with that architectural predictability (faster, denser, smaller), semiconducdtor memory prices went on roller coaster rides because of the commodity nature of the business.
Related Semiconductor IP
- AES GCM IP Core
- High Speed Ethernet Quad 10G to 100G PCS
- High Speed Ethernet Gen-2 Quad 100G PCS IP
- High Speed Ethernet 4/2/1-Lane 100G PCS
- High Speed Ethernet 2/4/8-Lane 200G/400G PCS
Related Blogs
- Can the Semiconductor Industry Overcome Thermal Design Challenges in Multi-Die Systems?
- When will you be facing these 28nm design challenges?
- Why IC Prices Will Be High In 2011
- Global semiconductor market will be $313 billion in 2012: SSIA
Latest Blogs
- Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications
- Migrating the CPU IP Development from MIPS to RISC-V Instruction Set Architecture
- Quintauris: Accelerating RISC-V Innovation for next-gen Hardware
- Say Goodbye to Limits and Hello to Freedom of Scalability in the MIPS P8700
- Why is Hard IP a Better Solution for Embedded FPGA (eFPGA) Technology?