USB 3.0 PHY IP for TSMC
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USB 3.0 PHY IP
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21
USB 3.0 PHY IP
for TSMC
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USB3.0 build-in clock PHY, TSMC 55LP
- Smallest USB 3.2 Gen1x1 BCK PHY IP worldwide (e.g. IP size @40nm <0.36mm²)
- Fully compliant with Universal Serial Bus USB 3.2 Gen1x1, 2.0, and 1.1 electrical specifications
- Supports clock outputs from the internal BCK module
- Real-time calibrations to ensure frequency accuracy
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USB3.0 build-in clock PHY, TSMC 55LP, type-C
- Smallest USB 3.2 Gen1x1 BCK PHY IP worldwide (e.g. IP size @40nm <0.36mm²)
- Fully compliant with Universal Serial Bus USB 3.2 Gen1x1, 2.0, and 1.1 electrical specifications
- Supports clock outputs from the internal BCK module
- Real-time calibrations to ensure frequency accuracy
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USB3.0 build-in clock PHY, TSMC 22ULP 1.8V, N/S orientation, type-C
- Smallest USB 3.2 Gen1x1 BCK PHY IP worldwide (e.g. IP size @40nm <0.36mm²)
- Fully compliant with Universal Serial Bus USB 3.2 Gen1x1, 2.0, and 1.1 electrical specifications
- Supports clock outputs from the internal BCK module
- Real-time calibrations to ensure frequency accuracy
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USB3.0 build-in clock PHY, TSMC 22ULL 2.5V, N/S orientation, type-C
- Smallest USB 3.2 Gen1x1 BCK PHY IP worldwide (e.g. IP size @40nm <0.36mm²)
- Fully compliant with Universal Serial Bus USB 3.2 Gen1x1, 2.0, and 1.1 electrical specifications
- Supports clock outputs from the internal BCK module
- Real-time calibrations to ensure frequency accuracy
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USB3.0 build-in clock PHY, TSMC 22ULL 1.8V, N/S orientation, type-C
- Smallest USB 3.2 Gen1x1 BCK PHY IP worldwide (e.g. IP size @40nm <0.36mm²)
- Fully compliant with Universal Serial Bus USB 3.2 Gen1x1, 2.0, and 1.1 electrical specifications
- Supports clock outputs from the internal BCK module
- Real-time calibrations to ensure frequency accuracy
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USB 3.0 PHY
- Standard PHY interface (PIPE) enables multiple IP sources for USB 3.0 Link Layer
- Supports 5.0 GT=s serial data transmission rate
- Supports 16- or 32-bit parallel interface
- Supports PCLK as PHY output
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USB 3.0/ PCIe 2.0/ SATA 3.0 Combo PHY IP, Silicon Proven in TSMC 22ULP
- Compatible with PCIe/USB3/SATA base Specification
- Fully compatible with PIPE3.1 interface specification
- Data rate configurable to 1.5G/2.5G/3G/5G/6G for different application
- Support 16-bit or 32-bit parallel interface when encode/decode enabled
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USB 3.0 PHY in TSMC (65nm, 55nm, 40nm, 28nm)
- Complete mixed-signal physical layer for USB 3.0 applications
- Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
- USB-C 3.0 femtoPHY supports Type-C reversible connectors
- Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)
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USB-C 3.0 femtoPHY in Type-C in TSMC (28nm, 16nm, 12nm)
- Complete mixed-signal physical layer for USB 3.0 applications
- Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
- USB-C 3.0 femtoPHY supports Type-C reversible connectors
- Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)
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USB 3.0 femtoPHY in TSMC (28nm, 22nm, 16nm, 12nm)
- Complete mixed-signal physical layer for USB 3.0 applications
- Includes all circuitry needed for operation at all USB speeds (SuperSpeed, High-Speed, FullSpeed, Low-Speed)
- USB-C 3.0 femtoPHY supports Type-C reversible connectors
- Optimized PHY area (<0.5mm2 for USB 3.0, <0.8mm2 for USB-C 3.0)