Ethernet IP for TSMC

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Compare 22 Ethernet IP for TSMC from 6 vendors (1 - 10)
  • 1G Deep Buffering Memory Ethernet Switch IP Core
    • Delivers Performance
    • Highly Configurable
    • Easy to use
    • Silicon Agnostic
    Block Diagram -- 1G Deep Buffering Memory Ethernet Switch IP Core
  • 224G Ethernet PHY, TSMC N3P x1, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 224Gbps data rates
    • Enables 200G, 400G, 800G, and 1.6T Ethernet
    • Ethernet interconnects for wired network infrastructure
    • Supports IEEE 802.3 and OIF-224G standards electrical specifications
    Block Diagram -- 224G Ethernet PHY, TSMC N3P x1, North/South (vertical) poly orientation
  • 224G Ethernet PHY, TSMC N3E x4, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 224Gbps data rates
    • Enables 200G, 400G, 800G, and 1.6T Ethernet
    • Ethernet interconnects for wired network infrastructure
    • Supports IEEE 802.3 and OIF-224G standards electrical specifications
    Block Diagram -- 224G Ethernet PHY, TSMC N3E x4, North/South (vertical) poly orientation
  • 112G PHY, TSMC N7 x4, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G PHY, TSMC N7 x4, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N7 x4, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N7 x4, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N7 x2, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N7 x2, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N7 x1, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N7 x1, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N6 x2, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N6 x2, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N6 x1, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N6 x1, North/South (vertical) poly orientation
  • 112G Ethernet PHY, TSMC N5 x4, North/South (vertical) poly orientation
    • Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
    • Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
    • Supports IEEE 802.3ck and OIF standards electrical specifications
    • Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
    Block Diagram -- 112G Ethernet PHY, TSMC N5 x4, North/South (vertical) poly orientation
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