Samsung Foundry and Arm FDSOI collaboration announced
The challenge with designing at newer and more advanced process nodes is that things generally don’t get less complex and expensive, much as we might want this. Still, the upside to each new process node, generally, is that you can build more highly efficient and targeted devices to address more markets and applications in a timely fashion.
For the complexity and cost challenges, however, there’s good news: Arm and Samsung Foundry just announced a comprehensive, foundry-sponsored physical IP platform, including an eMRAM compiler at 18FDS (18nm FDSOI). In addition, the Arm offerings for 18FDS include three POP IP packages for Arm Cortex-A55, Cortex-R52 and Cortex-M33 processor IP.
The platform will help drive new leading-edge designs in power-sensitive applications in 5G, artificial intelligence (AI), automotive, Internet of Things (IoT), and other market segments. It’s the industry’s first, fully comprehensive physical IP platform that includes an eMRAM compiler at 18FDS.
Related Semiconductor IP
- 12-bit, 4 GSPS High Performance IQ ADC in 22nm FD-SOI
- LDO With ULP Ludicrous Mode - GLOBALFOUNDRIES 22nm FDSOI
- Low Power RC Oscillator on Globalfoundries 22nm FDSOI
- GLOBALFOUNDARIES 22nm FDSOI LVDS Transceiver Pad
- Samsung 28nm FDSOI USB3.0 and PCIE2 combo PHY
Related Blogs
- Samsung is NOT a Foundry!
- Re-defining Collaboration
- 28nm FD-SOI: Samsung & ST's Major Opportunity
- STM FD-SOI Manufacturing Double Source: Samsung
Latest Blogs
- Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications
- Migrating the CPU IP Development from MIPS to RISC-V Instruction Set Architecture
- Quintauris: Accelerating RISC-V Innovation for next-gen Hardware
- Say Goodbye to Limits and Hello to Freedom of Scalability in the MIPS P8700
- Why is Hard IP a Better Solution for Embedded FPGA (eFPGA) Technology?