Designed in China. The next big thing?
January 24, 2012
China's emergence as a 'next Silicon Valley' had many flavors at the Consumer Electronics Show (CES) in Las Vegas this week. There, companies like Huawei, Haier, Lenovo and scores of other home-grown Chinese brands touted new mobile phones, tablet PCs, smart TVs and other gadgets for the growing global consumer electronics sector.
To learn more about this technology trend in China, The Next Silicon Valley interviewed Peter Clarke, European News Director of EE Times in the UK this week.
To read the full article, click here
Related Semiconductor IP
- 1.8V/3.3V I/O library with ODIO and 5V HPD in TSMC 16nm
- 1.8V/3.3V I/O Library with ODIO and 5V HPD in TSMC 12nm
- 1.8V to 5V GPIO, 1.8V to 5V Analog in TSMC 180nm BCD
- 1.8V/3.3V GPIO Library with HDMI, Aanlog & LVDS Cells in TSMC 22nm
- Specialed 20V Analog I/O in TSMC 55nm
Related Blogs
- Mass bankruptcies in China chip industry
- Update: China may Win in AI Computing
- The Future of Technology: Generative AI in China
- SoC design in China and the future for 28nm
Latest Blogs
- Cadence Unveils the Industry’s First eUSB2V2 IP Solutions
- Half of the Compute Shipped to Top Hyperscalers in 2025 will be Arm-based
- Industry's First Verification IP for Display Port Automotive Extensions (DP AE)
- IMG DXT GPU: A Game-Changer for Gaming Smartphones
- Rivos and Canonical partner to deliver scalable RISC-V solutions in Data Centers and enable an enterprise-grade Ubuntu experience across Rivos platforms