Designed in China. The next big thing?
China's emergence as a 'next Silicon Valley' had many flavors at the Consumer Electronics Show (CES) in Las Vegas this week. There, companies like Huawei, Haier, Lenovo and scores of other home-grown Chinese brands touted new mobile phones, tablet PCs, smart TVs and other gadgets for the growing global consumer electronics sector.
To learn more about this technology trend in China, The Next Silicon Valley interviewed Peter Clarke, European News Director of EE Times in the UK this week.
Related Semiconductor IP
- 1-port Receiver or Transmitter HDCP 2.3 on HDMI 2.1 ESM
- HDMI 2.0/MHL RX Combo 1P PHY 6Gbps in TSMC 28nm HPC 1.8V, North/South Poly Orientation
- HDMI 2.0 RX PHY in SS 8LPP 1.8V, North/South Poly Orientation
- HDMI 2.0 RX Controller with HDCP
- HDMI 2.0 RX 4P PHY 6Gbps in TSMC 28nm HPM 1.8V, North/South Poly Orientation
Related Blogs
- Mass bankruptcies in China chip industry
- Update: China may Win in AI Computing
- SoC design in China and the future for 28nm
- Outsourcers Look To China, As Obama Goes To India
Latest Blogs
- Scaling Out Deep Learning (DL) Inference and Training: Addressing Bottlenecks with Storage, Networking with RISC-V CPUs
- Cadence Transforms Chiplet Technology with First Arm-Based System Chiplet
- Redefining XPU Memory for AI Data Centers Through Custom HBM4 – Part 2
- Redefining XPU Memory for AI Data Centers Through Custom HBM4 – Part 1
- Why Choose Hard IP for Embedded FPGA in Aerospace and Defense Applications