Highly powerful and scalable multi-mode communication processor for IoT wireless applications

Overview

The fifth generation of the widely licensed Ceva-XC architecture, the Ceva-XC323 is optimized for IoT communication applications as well as UE terminals. The Ceva-XC323 delivers highly powerful vector capabilities alongside a general computation engine to supply the performance and flexibility demanded by various IoT communication applications.

Key Features

  • Fully programmable DSP processor architecture: Two vector processing units - each unit operates on 256-bit vector registers offering a powerful SIMD engine
    • Up to 8 simultaneous instructions (8-Way VLIW)
    • Efficient DSP support for non-vectorized data
    • Efficient support for control and ANSI-C operations
  • Extremely powerful computation capabilities
    • 32 16x16-bit MAC operations
    • 64 arithmetic operations per cycle
    • Over 200 16-bit operations in a cycle
  • Exceptional power efficiency
    • Incorporates Power Scaling Unit – PSU 2.0
    • Dedicated power optimized Tightly Coupled Extensions (TCE)
    • Enhanced power-optimized pipeline
  • Scalable and configurable architecture for use in a wide range of wireless communication applications and devices through different processors, configurations and optional modules
    • Scalable computation capabilities and memories
    • Configurable utilization of optional instruction sets
  • Uniquely designed for communication applications
    • High flexibility SIMD programming model with intra-vector permutation capabilities
    • Optimized modem instruction sets including high precision ISA, ML MIMO detectors, filtering, complex data permutations, and more
  • Tightly Coupled Extensions (TCE)
    • A selection of coprocessor units allowing efficient low power implementation of demanding transceiver algorithms including:
      • MLD MIMO detector up to Rank4
      • 3G De-spreader units
      • Fast Hadamard Transform
      • DFT
      • FFT
      • Viterbi decoding
      • LLR processing and HARQ combining
    • User-defined coprocessor interface enabling customers to reuse their existing proprietary IP
    • Offers parallel computing in parallel to the DSP functions
    • Offloading the core and lowering its frequency to minimize power consumption
  • Complete memory subsystem
    • Includes tightly coupled memories (TCM), caches, AXI system interfaces, APB interface, advanced DMA controller,, message queues, emulation and profiling modules.
    • Ensures easy integration and optimal performance in Target SoCs
  • Integrates an innovative second generation Power Scaling Unit (PSU 2.0) offering significant energy savings for both battery-operated and stationary devices
    • Advanced power management for both dynamic and leakage power
    • Multiple voltage domains associated with the functional units
    • Multiple operational modes ranging from full operation, to debug bypass, to memory retention, to complete power shut-off (PSO)

Block Diagram

Highly powerful and scalable multi-mode communication processor for IoT wireless applications Block Diagram

Technical Specifications

Maturity
In Production
Availability
Available
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Semiconductor IP