Chiplet and D2D IP

After years of steady SoC and ASIC aggregation to pack more functionality into a monolithic single die, the semiconductor industry can no longer meet growing performance demands. In the face of performance, area constraints, and reticle limits, and with the cost of production at advanced nodes skyrocketing, there is renewed interest in a disaggregated approach to chip development.

A die-to-die IP is a functional block that provides the data interface between two silicon dies that are assembled in the same package. Die-to-die interfaces take advantage of very short channels to connect two dies inside the package to achieve power efficiency and very high bandwidth efficiency, beyond what traditional chip-to-chip interfaces achieve.