Ethernet IP for TSMC
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Ethernet IP
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22
Ethernet IP
for TSMC
from 6 vendors
(1
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10)
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10 Gb/s full HW stack UDP/IP Transmitter/Receiver
- Transmits UDP with IP packets up to 10Gb/s, with 10G Ethernet protocol to host
- Receives UDP with IP packets up to 1Gb/s with 10G Ethernet protocol from host
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Ethernet Packet Switch 1G
- Complies to IEEE 802.3 standard
- Smallest size Ethernet Switch available
- GMII ports included in IP
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10/100/1000 base T ethernet Phy
- IEEE 802.3-2008, IEEE 802.3az fully standards compliant
- IEEE 1588-2008 support
- BroadR-Reach™ support
- Dual port MAC interface:
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224G Ethernet PHY, TSMC N3P x1, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 224Gbps data rates
- Enables 200G, 400G, 800G, and 1.6T Ethernet
- Ethernet interconnects for wired network infrastructure
- Supports IEEE 802.3 and OIF-224G standards electrical specifications
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112G PHY, TSMC N7 x4, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet PHY, TSMC N7 x4, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet PHY, TSMC N7 x2, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet PHY, TSMC N7 x1, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet PHY, TSMC N6 x2, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
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112G Ethernet PHY, TSMC N6 x1, North/South (vertical) poly orientation
- Supports full-duplex 1.25 to 112Gbps data rates in several lane configurations
- Enables 100G, 200G, 400G, 800G Ethernet interconnects for wired and optical network infrastructure
- Supports IEEE 802.3ck and OIF standards electrical specifications
- Meets the performance requirements of multi-die, co-packaged optics, near-packaged optics, chip-to-chip, chip-to-module, and backplane interconnects
