TSMC CLN5FF Glink 2.0 Die-to-Die PHY

IGAD2DY01A is a high speed die-to-die interface PHY which transmits data through TSMC advanced packaging solutions:Integrated Fan-Out (InFO) with RDL interconnect and Chip-on-Wafer-on-Substrate (CoWoS®) with silicon interposer. IGAD2DY01A contains 32 TX lanes and 32 RX lanes per slice and supports 8 slices in one PHY. Each TX/RX lane can support up to 16 Gbps data rate. In summary, IGAD2DY01A offers a full-duplex data transmission with extremely low power and up to 512 Gbps data rate per slice in both directions.
Each TX/RX slice contains PMA and PCS modules. PMA supports serialization, de-serialization, data transmission, eye training and lane repair functions. PCS provides data bus inversion, CRC/Parity check and FIFO functions. One PLL is also included in IGAD2DY01A to generate 8GHz high speed clock for data transmission.
IGAD2DY01A is designed and fabricated in TSMC 5nm FF CMOS process with 1.2V analog supply voltage for PLL/PMA and 0.75V analog/digital supply voltages. Independent low power mode for PLL and slices is available.