Bunch of Wires IP
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Bunch of Wires (BoW) is an energy-efficient, easy-to-use PHY interface between a pair of die inside a single package. The BoW PHY is defined as a single unidirectional slice. Multiple slices are combined to create links of the desired throughput. A link may be symmetric, asymmetric or unidirectional. The BoW PHYs between two die are physically connected through wires on a substrate or interposer.
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Bunch of Wires IP
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7
Bunch of Wires IP
from 5 vendors
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7)
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UCIe/BoW BlueLynx™ Dual Mode PHY and subsystem IP for chiplet interconnect
- Emerging Standard Knowledge
- Flexibly Configurable
- Best in Class PPA
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2-16Gbps Multi-Protocol IO Supporting BOW, OHBI and UCIe
- Efficiency
- Composability
- Programmability
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Die-to-Die PHY
- 64 data lanes with configuration and bump map layout dependent on the PHY type (UCIe, BoW, UMI, SBD)
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UniPHY™ IoT IP: Ultra Low Power and Smallest PHY area for low cost Chiplets
- 0.25mm2 compared to 1.5mm2
- Low-cost technology support
- No PLL required
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2GBps Low Power D2D Interface
- Core Device: 0.9V
- I/O Device: 1.8V Standard
- Core: Uses SVT only
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2Gbps Low Power D2D Interface
- Core Device: 0.8V
- I/O Device: 1.8V Standard
- Core: Uses SVT only
- BEOL: M8 and below
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600Mbps Low Power D2D Interface in 16nm
- Core Device: 0.8V
- I/O Device: 1.8V Standard
- Core: Uses SVT only