The NuLink technology delivers low-power and high-performance D2D IP core products, which support multiple industry standards and are available on both standard and advanced packaging.
The vendor uses its NuLink technology to develop die-to-die PHY IP products to support multiple standards (including UCIe and BoW) and multiple packaging types (including advanced packaging and standard packaging).
For Standard Packaging, the vendor has a family of high-bandwidth interface IP cores that are designed to be integrated into ASIC designs to connect two dies (chiplets) on the same standard organic/laminate package substrate. The PHY technologies with patented implementation techniques enable the same levels of performance and power as those provided by advanced packaging options, while providing benefits to system design, cost, thermal, test, yield, and production cycle-time by utilizing industry standard packaging. In many applications this eliminates the need for advanced packaging technologies such as silicon interposers or silicon bridges.
