UniPHY™ IoT IP: Ultra Low Power and Smallest PHY area for low cost Chiplets

Overview

Key Features

• YorChip UniPHY™ IOT version is cost optimized, lower bandwidth version of YorChip’s multi-protocol PHY which supports UCIe and BOW standards. The area reduction over tradition die-to-die standards is over 75%. UniPHY™ IOT can connect to UCIe and BOW devices with future bridge chiplets. Full IP deliverables and flexible licensing models available – MPW, Single and Multi-use.
• YorChip UniPHY™ IOT has built-in security and ID which can be used to secure the link data to its host chiplet – solves an increasingly critical IOT problem.
• YorChip UniPHY™ IOT is designed for simple integration and supports low-cost organic substrates and no external PLL is required and operates with clock from the host chiplet reducing cost and complexity.
• YorChip UniPHY™ IOT includes YorCHIP patented Known Good Die technology which assures customers of Chiplet functionality and history prior to assembly – more details under NDA.

Benefits

• 0.25mm2 compared to 1.5mm2 ( area cost of BOW or UCIe PHY)
• Low-cost technology support @ 40nm, 22nm, 12 nm node & easy to port
• No PLL required – designed to use host PLL – reduces cost & complexity
• Built-in Physically Unclonable Function ( for security & ID) at no extra cost
• Low power PHY @ 0.5 pj / bit supports IOT power sensitive applications

Applications

• IOT
• Mass Market projects needing chiplets

Deliverables

• GDS2
• LEF
• IBIS

Technical Specifications