HSIC PHY

Overview

The Innosilicon HSIC PHY is fully compliant with the High-Speed Inter-Chip Supplement to the USB 2.0 Specification. By stripping off all the legacy USB overhead, this PHY is the size of a few IO pads and passes data at 480Mb/s, while leveraging the existing USB 2.0 software stack. Optimized for both area and power, it contains all the necessary PHY components such as IO's and ESD.

Key Features

Consumes <90mW during data transfer
Consumes <50uW when not transferring data
Uses standard chip digital and IO supplies
Low pin count
Designed to fit into a GPIO ring
Compliant with the High-Speed Inter-Chip Supplement to the USB 2.0 Specification
Data rate of 480 Mb/s
Standard UTMI+ interface to controller
Integrated Low jitter, fixed bandwidth PLL
Includes BIST, loop back and boundary scan
Easily ported into any technology

Benefits

Low power consumption
Fully customizable
Small area
Simple integration process
Available options include
Test chips and test boards
FPGA integration support
Chip level integration

Applications

Application processor interfaces
PCB Embedded devices

Deliverables

We can provide the following deliverables to aid quick and reliable integration into the design flow. Please contact us for any additional views:
GDSII
Netlist (Spice format for LVS)
Footprint (LEF format)
User documentation
Module integration guidelines
Datasheet
Silicon validation report
Evaluation board

Technical Specifications

Foundry, Node

GF 55/28/22/14/12nm, SMIC 55/40/28/14nm, Samsung 14nm, TSMC 55/40/28/22nm, UMC 55/40/28/22nm, HLMC 40/28nm

Maturity

Silicon proven and in production

Availability

now

GLOBALFOUNDRIES

In Production: 12nm , 14nm LPP , 22nm FDX , 28nm SLP , 55nm LPX
Silicon Proven: 12nm , 14nm LPP , 22nm FDX , 28nm SLP , 55nm LPX

SMIC

In Production: 14nm , 28nm HKC+ , 40nm LL , 55nm LL
Silicon Proven: 14nm , 28nm HKC+ , 40nm LL , 55nm LL

Samsung

In Production: 14nm
Silicon Proven: 14nm

TSMC

In Production: 22nm , 28nm HPC , 28nm HPCP , 28nm HPM , 40nm G , 40nm LP , 55nm LP
Silicon Proven: 22nm , 28nm HPC , 28nm HPCP , 28nm HPM , 40nm G , 40nm LP , 55nm LP

UMC

In Production: 22nm , 28nm HPC , 40nm LP , 55nm
Silicon Proven: 22nm , 28nm HPC , 40nm LP , 55nm

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