Other for TSMC

Compare 6 Other for TSMC from 3 vendors (1 - 6)

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Die-to-Die, High Bandwidth Interconnect PHY Ported to TSMC N7 X24
- Delivers up to 4Gbps per pin with up to bidirectional 2 Tbps/mm of die edge
- High-bandwidth, low-power, low-latency multi-channel PHY in applications requiring connections between dies within a package
- Compliant with Intel Advanced Interface Bus (AIB) v1.1 standard
- Compliant with IEEE 1149.1 (JTAG), 1149.6 (AC JTAG) for easy integration with SoC testability framework
Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N7 X16, North/South (vertical) poly orientation
- 16-lane TX and RX square macros for placement in any edge of the die
- Supports 2.5G to 112G data rates, enabling very high bandwidth per mm of beachfront for die-to-die and die-to-optical engine connectivity
- Implements NRZ and PAM-4 signaling
- Meets the performance, efficiency, and reliability requirements of die-to-die interconnects
Die-to-Die, High Bandwidth Interconnect PHY in TSMC (N7, N5)
- Data rates of up to 4Gbps per pin
- Self-contained hard macro
- Self-calibrating RX sampling phase and threshold selection
- Built-in self-test (BIST), internal loopback, and external PHY-to-PHY link test
Die-to-Die, 112G Ultra-Extra Short Reach PHY in TSMC (12nm, N7, N6, N5)
- Offers leading performance, power, and area / beachfront per terabit
- Includes 16 lanes of NRZ and PAM-4 transmitters or receivers
- Targeting the OIF XSR standards: CEI-112G and CEI-56G
- Implements robust clock forwarded and embedded clock recovery algorithms for additional flexibility
INNOLINK-C PHY
- LPDDR5 like interface with IO voltage 0.4V and core power supply 0.9V
- 12Gbps for maximum IO speed in HLMC 28nm process
- Default 64-bit DQ Tx+ 64-bit DQ Rx per module, module number can be 1/2/4/8/16 or more
- Burst data, forward clock, no CDR
TSMC CLN7FF GLink-3D Die-to-Die Slave PHY
- Supports SoIC (3DFabric) CoW and WoW assembly
- Supports face to face and face to back with the same GDSII