USB3.1/3.0 PHY & Controller

Overview

The Innosilicon USB3.0 PHY is a highly programmable module that processes high-speed serial data to parallel data compatible with the PHY Interface for USB3.0 standard from Intel. The PHY supports USB3.0 SuperSpeed (5Gb/s) physical layer specifications.
This document describes the operation and performance of the PHY, which includes a top-level wrapper integrating both the Physical Media Attachment (PMA) layer, and the Physical Coding Sub-Block (PCS) layer.

Key Features

  • Reference Clock:
    • 25-300MHz, integer multiple of Serial output
    • +/-300ppm frequency stability (<20Gbps)
    • Support both SRNS & SRIS mode
    • Configurable as reference clock repeater
  • Internal PLL:
    • Used to drive all PHY transmitters and receivers
    • Ring PLL covering 1.0-5Gbps
    • Programmable pre-divider & feedback divider
    • Initiative SSC or reference clock based passive SSC
    • LOCK indication
  • Data Transmit:
    • Rates supported from 1.0-5 Gbps
    • AC coupled
    • 50? impedance, internally calibrated
    • 200-1100mV differential peak-peak, programmable
    • 3 tap pre/post-cursor de-emphasis, programmable
    • Programmable Rise/Fall times
  • Data Receive:
    • AC coupled
    • 50? impedance, internally calibrated
    • 200-1200mV differential peak-peak
    • CTLE, programmable
    • DFE, 6-tap programmable
    • CDR
  • Testing:
    • Scan
    • BIST with PRBS7/23 and PRBS31 (generator & checker)
    • Loopback (near end, far end, on/off-die)
    • On-chip scope (eye height & width)
    • Analog and digital probe points
    • HTOL
    • IDDQ
  • ESD:
    • HBM 2000V, [JEDEC JS-001-2014]
    • MM 100V, [JEDEC JESD22-A115C]
    • CDM 250V, [JEDEC JESD22-C101F]
  • Latch Up:
    • +-200mA for IO and 1.5*Vsupply for power rails
  • Package:
    • Wire bond with careful SI/PI analysis for 8Gbps and below
    • Flip-Chip with careful SI/PI analysis for 8Gbps and Up
  • Interface with controller:
    • PIPE4.3 & 32 bits data bus for USB3.x

Deliverables

  • Verilog Sim Behavioral simulation model for the PHY
  • Encrypted IO spice netlist for SI evaluation
  • Integration Guidelines
  • Test Guidelines
  • GDSII Layout and layer map for foundry merge
  • Place and Route LIB and LEF views for the AFE
  • LVS and DRC verification reports

Technical Specifications

Foundry, Node
UMC 28/22nm, SMIC 40/28/14nm, TSMC 22/16/12/5/4/3nm, Samsung 28/14/10/8nm
SMIC
In Production: 14nm , 28nm HKC+ , 40nm LL
Silicon Proven: 14nm , 28nm HKC+ , 40nm LL
Samsung
In Production: 8nm , 10nm , 14nm , 28nm FDS , 28nm LPP
Silicon Proven: 8nm , 10nm , 14nm , 28nm FDS , 28nm LPP
TSMC
In Production: 12nm , 22nm
Silicon Proven: 12nm , 22nm
UMC
In Production: 22nm , 28nm HPC
Silicon Proven: 22nm , 28nm HPC
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Semiconductor IP