The Innosilicon USB3.0 PHY is a highly programmable module that processes high-speed serial data to parallel data compatible with the PHY Interface for USB3.0 standard from Intel. The PHY supports USB3.0 SuperSpeed (5Gb/s) physical layer specifications.
This document describes the operation and performance of the PHY, which includes a top-level wrapper integrating both the Physical Media Attachment (PMA) layer, and the Physical Coding Sub-Block (PCS) layer.
USB3.1/3.0 PHY & Controller
Overview
Key Features
- Reference Clock:
- 25-300MHz, integer multiple of Serial output
- +/-300ppm frequency stability (<20Gbps)
- Support both SRNS & SRIS mode
- Configurable as reference clock repeater
- Internal PLL:
- Used to drive all PHY transmitters and receivers
- Ring PLL covering 1.0-5Gbps
- Programmable pre-divider & feedback divider
- Initiative SSC or reference clock based passive SSC
- LOCK indication
- Data Transmit:
- Rates supported from 1.0-5 Gbps
- AC coupled
- 50? impedance, internally calibrated
- 200-1100mV differential peak-peak, programmable
- 3 tap pre/post-cursor de-emphasis, programmable
- Programmable Rise/Fall times
- Data Receive:
- AC coupled
- 50? impedance, internally calibrated
- 200-1200mV differential peak-peak
- CTLE, programmable
- DFE, 6-tap programmable
- CDR
- Testing:
- Scan
- BIST with PRBS7/23 and PRBS31 (generator & checker)
- Loopback (near end, far end, on/off-die)
- On-chip scope (eye height & width)
- Analog and digital probe points
- HTOL
- IDDQ
- ESD:
- HBM 2000V, [JEDEC JS-001-2014]
- MM 100V, [JEDEC JESD22-A115C]
- CDM 250V, [JEDEC JESD22-C101F]
- Latch Up:
- +-200mA for IO and 1.5*Vsupply for power rails
- Package:
- Wire bond with careful SI/PI analysis for 8Gbps and below
- Flip-Chip with careful SI/PI analysis for 8Gbps and Up
- Interface with controller:
- PIPE4.3 & 32 bits data bus for USB3.x
Deliverables
- Verilog Sim Behavioral simulation model for the PHY
- Encrypted IO spice netlist for SI evaluation
- Integration Guidelines
- Test Guidelines
- GDSII Layout and layer map for foundry merge
- Place and Route LIB and LEF views for the AFE
- LVS and DRC verification reports
Technical Specifications
Foundry, Node
UMC 28/22nm, SMIC 40/28/14nm, TSMC 22/16/12/5/4/3nm, Samsung 28/14/10/8nm
SMIC
In Production:
14nm
,
28nm
HKC+
,
40nm
LL
Silicon Proven: 14nm , 28nm HKC+ , 40nm LL
Silicon Proven: 14nm , 28nm HKC+ , 40nm LL
Samsung
In Production:
8nm
,
10nm
,
14nm
,
28nm
FDS
,
28nm
LPP
Silicon Proven: 8nm , 10nm , 14nm , 28nm FDS , 28nm LPP
Silicon Proven: 8nm , 10nm , 14nm , 28nm FDS , 28nm LPP
TSMC
In Production:
12nm
,
22nm
Silicon Proven: 12nm , 22nm
Silicon Proven: 12nm , 22nm
UMC
In Production:
22nm
,
28nm
HPC
Silicon Proven: 22nm , 28nm HPC
Silicon Proven: 22nm , 28nm HPC
Related IPs
- D2D Controller addon for D2D SR112G PHY with CXS interface
- HBM3 Solution enabling access to HBM3 Controller and HBM3 PHY in TSMC N5 1.2V
- HBM3 V2 Solution enabling access to HBM3 Controller and HBM3 PHY in TSMC N3E
- UCIe-S PHY for Standard Package (x16) in TSMC N3E, North/South Orientation
- Die-to-Die, 112G Ultra-Extra Short Reach PHY Ported to TSMC N5 X8, North/South (vertical) poly orientation
- UCIe-S PHY for Standard Package (x16) in SS SF5A, North/South Orientation