USB2.0 OTG PHY UMC 40nm LP/RVT process, for Flip chip Bump type_LF
Overview
USB2.0 OTG PHY UMC 40nm LP/RVT process, for Flip chip Bump type_LF
Technical Specifications
Foundry, Node
UMC 40nm
UMC
Pre-Silicon:
40nm
,
40nm
LP
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