Multi-protocol wireless plaform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)

Overview

Key Features

• Full Bluetooth dual mode (Classic and LE) support, including next generation High Data Throughput up to 7.5Mbps for lossless multichannel low latency audio streaming.
• IEEE 802.15.4 support, for Zigbee, Thread and Matter
• Comprehensive Integration: Includes RF, modem, controller, software stacks, and profiles.
• Advanced Audio Support: Supports Classic Audio, LE Audio, and Auracast Broadcast Audio.
• Accurate and Secure Ranging: Supports Bluetooth Channel Sounding for precise and secure ranging.
• Optimized Process: Utilizes TSMC 12nm FFC+ process, ideal for advanced smart audio and Smart Edge AI SoCs.
• Superior Performance: Fully featured with best-in-class power consumption, die size, and performance, with state-of-the-art RF architecture requiring minimal external components for low bill of materials.
• Ease of Integration: Designed for fast time to market.
• Customizable for further product differentiation, via tight integration with Ceva’s sensing and inference IPs, including Ceva-NeuPro-Nano NPU, and Ceva-RealSpace Spatial Audio.

Benefits

• Implementing several connectivity standards in one SoC is a frequent requirement, but it has the potential to become far more complex than just the sum of the parts. Not only does the design require use-case-optimized MAC and PHY hardware IP and comprehensive protocol software for each mode, but it is necessary to efficiently interface each PHY to co-located radios or a shared radio. And operation of all the hardware must be orchestrated to avoid peak power issues, contention for the radio, or mutual interference between modes. Ceva-Waves Links solves all these problems by providing preconfigured, integrated, and optimized instances of MAC and PHY IP and software from the field-proven Ceva-Waves platform family. Members of the family span the performance range from energy-efficient IoT connectivity solutions to complex high-performance connectivity hubs. The IP designs provide hardware offload for key computational tasks including security, encryption, and difficult MAC functions. This not only speeds implementation of each individual module but avoids the potentially treacherous problem of integrating the modules and understanding their interactions. Thus, the Ceva-Waves Links platforms can provide very substantial reductions in design time and risk for multi-protocol SoCs, while providing state of the art performance for a broad range of applications including TWS earbuds, XR headsets, smart speakers, hearing aids, home audio, gaming, smart home, medical, automotive, smart watches and other consumer, wearable and Smart Edge AI IoT devices.

Deliverables

• Hardware: verilog RTL, testbench, compilation, simulation and synthesis scripts
• Software: C code packages for each wireless protocol
• Documents

Technical Specifications