The Ceva-Waves Links100 is a low-power multi-protocol wireless connectivity IoT platform combining a cost-optimized Wi-Fi 6 1×1 40 MHz solution, a Bluetooth 5.4 dual-mode solution supporting LE and Classic Audio and numerous profiles, and an 802.15.4 solution for Zigbee, Thread and Matter compliance. These modules are pre-integrated with a single low-power 2.4 GHz radio implemented in TSMC 22 nm and their operation is orchestrated through smart coexistence mechanisms.
Multi-protocol wireless plaform integrating 802.11ax (Wi-Fi 6), Bluetooth 5.4 Dual Mode, 802.15.4 (for Thread, Zigbee and Matter)
Overview
Key Features
- Highly versatile multi-protocol wireless connectivity solutions leveraging the latest and market proven Ceva-Waves integrated hardware IP and software platforms, including Wi-Fi, Bluetooth (Classic and LE), 802.15.4 (for Thread, Zigbee and Matter) and UWB
- Optimized co-existence schemes for each specific configuration
- Pre-integrated radio solutions, including RF from Ceva and various partners addressing a wide range of configurations and foundry process nodes
- Easily adaptable to other RF implementations including customer’s own in-house developments
- Hardware-accelerated embedded security modes and encryption to fully comply with the most demanding wireless-standard specifications
- Complemented by Ceva’s extensive IP portfolio of Edge AI, audio, voice and sensing solutions
Benefits
- Turnkey integrated multi-protocol hardware and software platform
- Faster TTF (Time to Fab) and TTM (Time to Market)
- Integrated unified testbench
- Optimized coexistence
- Pre-adapted for TSMC 22nm ULL RF
- Product specific customization available to fulfil project requirements
Block Diagram

Applications
- IoT, smart home, industrial, smart watch
Deliverables
- Hardware: verilog RTL, testbench, compilation, simulation and synthesis scripts
- Software: C code packages for each wireless protocol
- Documents
Technical Specifications
Foundry, Node
TSMC 22nm ULL
Maturity
Ready for Production
Availability
Available
TSMC
Pre-Silicon:
40nm
LP
Related IPs
- Multi-protocol wireless platform integrating Bluetooth Dual Mode, IEEE 802.15.4 (for Thread, Zigbee and Matter)
- v5.3 Dual Mode Software Stack and Profiles for Classic Bluetooth and Bluetooth low energy
- Bluetooth Dual Mode (Classic & BLE ) v5.3 Protocol Software Stack and Profiles IP
- Bluetooth Dual Mode v4.2 RF Transceiver IP
- Bluetooth Dual Mode (Classic & BLE ) v5.0 Protocol Software Stack and Profiles IP
- Bluetooth Dual Mode v5.4 / IEEE 15.4 PHY/RF IP in TSMC22nm ULP