40G Ultralink D2D PHY for TSMC 3nm

Overview

Proprietary chiplet interconnect solution with high-performance, high-bandwidth, and long reach die-to-die link connectivity

The Cadence® 40G proprietary D2D PHY IP provides an alternative to the high cost of on-die integration, as it caters to growing system-in-package (SiP) applications: CPU to CPU in a multi-core SoC, low-latency coherent interconnect, DSP arrays to process information from lidar, switch fabric integration on multi-chip module (MCM), network ASIC to SerDes PMD on separate die, and chip to in-package optical engine. Today’s emerging hyperscale data centers and a new breed of accelerator / artificial intelligence / machine learning (AI/ML) applications are creating the need for increased per-socket compute power, high bandwidth, low power, and low latency die-to-die interconnectivity.

Key Features

Flexible data rate from 20Gbps to 40Gbps
Single-ended NRZ signaling scheme
BIST features ensure Known Good Die (KGD)
Sideband for link management
Interoperable between different technology nodes and foundries
1Tbps/mm unidirectional bandwidth
Low power and low latency
Easy routing and straightforward integration
Supports MCMs on organic substrates
Better than 1e-15 BER without requiring FEC

Applications

High Performance Compute,
AI,
ML,
Servers,
Networking,
Communications,
Consumer Electronics,
Data Processing,
Industrial and Medical,
Military/Civil Aerospace

Deliverables

Integration views: LEF abstract, timing views (.LIB), Verilog behavioral model, gate-level netlist, SDF, DRC, LVS, ANT reports, and GDSII layout and layer map
Verilog testbench with example run scripts, demonstration tests, and bus functional models
Full documentation set including integration, user, and programmer guides
DFT collateral including ATPG generation and setup guidelines and scan abstracts (CTL), High Volume Manufacturing (HVM) kit
IPXACT register abstracts, IBIS-AMI kit

Technical Specifications

Foundry, Node

TSMC 3nm

Maturity

Available on request

TSMC

Pre-Silicon: 3nm

Request Info