Die to Die IP for SMIC
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Die to Die IP
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6
Die to Die IP
for SMIC
from 2 vendors
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6)
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Die-2-die interfaces for chiplets
- Analog I/Os
- ESD Power protection
- Ground pads
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INNOLINK-C Controller
- General Features
- DFI Features
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INNOLINK-C PHY
- LPDDR5 like interface with IO voltage 0.4V and core power supply 0.9V
- 12Gbps for maximum IO speed in HLMC 28nm process
- Default 64-bit DQ Tx+ 64-bit DQ Rx per module, module number can be 1/2/4/8/16 or more
- Burst data, forward clock, no CDR
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INNOLINK-B Controller
- General Features
- DFI Features
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INNOLINK Chiplet PHY&Controller
- Innolink-A
- Meets the performance, efficiency and reliability requirements of B2B/C2C interconnects
- Already silicon proven
- Delivers 56Gbps/pair with -36dB insertion loss
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INNOLINK-B PHY
- Support both Die2Die and Chip2Chip application
- GDDR6 like interface with IO voltage is core power supply (0.8V for TSMC 12nm)
- 24Gbps for maximum IO speed
- Default 16bit DQ Tx+ 16bit DQ Rx per module, module number can be 1/2/4/8/16 or more