USB 2.0 PHY - SMIC 55nm Eflash
Key Features
- low cost;Low EMI; 6kV HBM ESD capability; Ultra-low size: 0.19mm2; USB2.0 LOGO
Benefits
- Cost saving compared to eflash technology
Deliverables
- Technical documents,GDS hard macro to foundry for IP merge
Technical Specifications
Foundry, Node
SMIC 55nm Eflash
Maturity
Silicon proven
Availability
immediate
SMIC
Silicon Proven:
55nm
G
,
55nm
LL