MIPI C/D-PHY CSI-2 RX IP

Overview

Innosilicon CSI-2 Receiver implements MIPI CSI-2 as well as C/D-PHY protocols. The CSI-2 link protocol specification is a part of group of communication protocols defined by MIPI Alliance standards intended for mobile system chip to chip communications. The CSI-2 specification is specially targets for Camera to Image application processor communication.
Innosilicon CSI-2 Receiver operates as a receiver of a CSI-2 link, which consists of a C/D combo PHY and a CSI-2 controller.
? The C/D combo PHY is used for the data transmission from a CSI-2 compliant camera sensor. In C/D-PHY, the link includes a High-Speed signaling for fast-data traffic and a low-power signaling mode for control purposes. Error information is generated for application layer to do further operation.
? The CSI-2 Receiver Controller works as a protocol layer between application layer and physical layer. It implements all three layers defined by CSI-2 Specifications, including Pixel Packing, Low Level Protocol, and Lane Management.

Key Features

  • Compliant with MIPI Alliance Standard for Camera Serial Interface 2 (CSI-2), V2.0
  • Compliant with MIPI Alliance Standard for C-PHY Specifications V1.1
  • Compliant with MIPI Alliance Standard for D-PHY Specifications V1.2
  • HS, LP and ULPS modes supported
  • The data transfer rate ranges from 450Msps to 2.5Gsps per trio (C-PHY)
  • The data transfer rate ranges from 400Mbps to 2.5Gbps per lane (D-PHY)
  • Implements all three CSI-2 MIPI Layers (Pixel/Byte Packing Layer, Low Level Protocol and Lane Management)
  • Asynchronous transfer at low power mode with a bit rate of 10Mbps on both C-PHY and D-PHY supported
  • Unidirectional mode supported
  • Support lane de-skew for D-PHY
  • Support date type: RGB/YUV/RAW (Based on actual application scenarios)
  • Error detection and correction supported
  • Automatic termination control for HS and LP modes

Deliverables

  • Databook and physical implementation guides Netlist (Spice format for LVS)
  • Library Exchange Format (LEF)
  • Encrypted Verilog Models
  • GDSII to Foundry IP Merge
  • Module integration guidelines
  • Silicon validation report (when available)
  • Evaluation board (when available)

Technical Specifications

Foundry, Node
SMIC 28/12nm
SMIC
In Production: 28nm
Silicon Proven: 28nm
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Semiconductor IP