Ultralink IP
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Ultralink IP cores enable a proprietary die-to-die solution for multi-die system in package integration over streaming, CXS, and AXI protocols.
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Ultralink IP
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7
Ultralink IP
from 2 vendors
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7)
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Ultralink Controller
- 1Tbps/mm unidirectional bandwidth
- Low power and low latency
- Easy routing and straightforward integration
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Chiplet Interconnect - Die-to-die interconnect IP solutions for advanced and standard packaging applications
- High data rate of 2–24 Gb/s
- Very low power of < 0.375 pJ/bit @ 2–16 Gb/s 0.5-V VDDQ
- Very low latency of < 2 ns PHY-to-PHY
- Support for 2:1, 4:1, 8:1, 12:1 and 16:1 serialization and deserialization ratios
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40G Ultralink D2D PHY for TSMC 7nm
- Flexible data rate from 20Gbps to 40Gbps
- Single-ended NRZ signaling scheme
- BIST features ensure Known Good Die (KGD)
- Sideband for link management
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40G Ultralink D2D PHY for TSMC 5nm
- Flexible data rate from 20Gbps to 40Gbps
- Single-ended NRZ signaling scheme
- BIST features ensure Known Good Die (KGD)
- Sideband for link management
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40G Ultralink D2D PHY for Samsung 7LPP
- Flexible data rate from 20Gbps to 40Gbps
- Single-ended NRZ signaling scheme
- BIST features ensure Known Good Die (KGD)
- Sideband for link management
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40G Ultralink D2D PHY for GF12LP+
- Flexible data rate from 20Gbps to 40Gbps
- Single-ended NRZ signaling scheme
- BIST features ensure Known Good Die (KGD)
- Sideband for link management
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40G Ultralink D2D PHY for TSMC 3nm
- Flexible data rate from 20Gbps to 40Gbps
- Single-ended NRZ signaling scheme
- BIST features ensure Known Good Die (KGD)