Arteris Announces Collaboration with IC-Link by imec to Accelerate Next-Gen AI and HPC Silicon
Arteris provides high-performance and energy-efficient, safe and secure silicon-proven network-on-chip (NoC) IP technology for AI ASIC with chiplet...
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Chiplets Semiconductor IP News & Insights
Follow the latest news, technical articles, expert perspectives and ecosystem updates related to Chiplets and semiconductor IP design.
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164 results about Chiplets
InPsytech Highlights UCIe Innovation at COMPUTEX with UCIe Live Demo and Ultra-high speed ONFI 6400 Development
InPsytech, a leading provider of high-speed semiconductor IP solutions and a member of the Egis Group, is presenting a live demonstration of its...
EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration
EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, announces the availability and readiness for customer...
Verification Sanity in Chiplets & Edge AI: Avoid the “Second Design” Trap
eFPGA integration doesn’t have to be complex. With the right approach, you can simplify verification, reduce risk, and stay on track to tape-out.
Rapidus Opens Analysis Center and Rapidus Chiplet Solutions
New facilities enhance Rapidus’ development environment to ensure a steady transition to mass production of cutting-edge semiconductors in 2027
Sarcina Launches UCIe-A/S Packaging IP to Accelerate Chiplet Architectures
Sarcina launches UCIe-A/S Packaging IP, enabling high-performance, scalable chiplet interconnects with reduced complexity and faster time-to-market.
Ultra Accelerator Link™ (UALink™) Consortium Publishes Four Specifications Defining In-Network Compute, Chiplets, Manageability and 200G Performance
The new specifications support the deployment of UALink solutions in multi-workload environments, while simultaneously helping improve UALink technology...
Arteris Network-on-Chip Technology Achieves Deployment Milestone of 4 Billion Chips and Chiplets
Arteris network-on-chip interconnect IP ships in production silicon at accelerating scale across AI-driven automotive, enterprise computing, consumer...
How UCIe 3.0 Redefining Chiplet Architecture: From Protocol to Platform
Explore how UCIe 3.0 is revolutionising chiplet architecture, evolving from a high-speed interconnect protocol to a unified platform that enables...
Arteris Selected by 2V Systems for IO Chiplet for Data Center
Arteris today announced that 2V Systems has licensed Arteris’ Ncore 3 cache coherent interconnect IP and Arteris’ FlexNoC 5 non-coherent interconnect...
InPsytech showcases 3nm UCIe 3.0 technology at OCP 2025, Accelerating Innovation in Chiplet Ecosystem
InPsytech has long focused on high-speed and low-power interface IP technologies. Its UCIe (Universal Chiplet Interconnect Express) portfolio supports...
UCIe™ Chiplet IP on TSMC 3DFabric® Platform
Alphawave Semi has announced the successful tape-out of its cutting edge UCIe™ 3D IP on the advanced TSMC SoIC® (SoIC-X) technology in the 3DFabric...
About Chiplets in semiconductor IP
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