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EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, announces the availability and readiness for customer...
eFPGA integration doesn’t have to be complex. With the right approach, you can simplify verification, reduce risk, and stay on track to tape-out.
New facilities enhance Rapidus’ development environment to ensure a steady transition to mass production of cutting-edge semiconductors in 2027
Sarcina launches UCIe-A/S Packaging IP, enabling high-performance, scalable chiplet interconnects with reduced complexity and faster time-to-market.
The new specifications support the deployment of UALink solutions in multi-workload environments, while simultaneously helping improve UALink technology...
Arteris network-on-chip interconnect IP ships in production silicon at accelerating scale across AI-driven automotive, enterprise computing, consumer...
Explore how UCIe 3.0 is revolutionising chiplet architecture, evolving from a high-speed interconnect protocol to a unified platform that enables...
Arteris today announced that 2V Systems has licensed Arteris’ Ncore 3 cache coherent interconnect IP and Arteris’ FlexNoC 5 non-coherent interconnect...
InPsytech has long focused on high-speed and low-power interface IP technologies. Its UCIe (Universal Chiplet Interconnect Express) portfolio supports...
Alphawave Semi has announced the successful tape-out of its cutting edge UCIe™ 3D IP on the advanced TSMC SoIC® (SoIC-X) technology in the 3DFabric...
The new US entity will be led by Rachael J. Parker and David Johnston, expanding the Group’s global footprint alongside existing operations in the...
By leveraging TSMC’s SoIC-X advanced 3D packaging technology, Alphawave Semi continues to push the boundaries of power, performance efficiency and...
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