TetraMem Announces 22nm Multi-Level RRAM Analog In-Memory Computing SoC Milestone 2026-05-17 05:53:00
aiMotive announces aiWare5, delivering unrivalled flexibility and scalability for L2+ to L4 automotive AI workloads 2026-05-15 07:22:16
IC Manage GDP-AI Transforms IP Lifecycle Management with Generative and Agentic AI 2026-05-14 16:41:37
Cadence Joins OpenTitan as a Tools Partner to Accelerate Open-Source Silicon Security 2026-05-14 12:44:18
TetraMem Announces 22nm Multi-Level RRAM Analog In-Memory Computing SoC Milestone 2026-05-17 05:53:00 Technology & Integration
aiMotive announces aiWare5, delivering unrivalled flexibility and scalability for L2+ to L4 automotive AI workloads 2026-05-15 07:22:16 IP Cores & Design
IC Manage GDP-AI Transforms IP Lifecycle Management with Generative and Agentic AI 2026-05-14 16:41:37 EDA & Design Tools
BrainChip Expands AI Ecosystem with Strategic Software Partners 2026-05-14 13:25:00 Strategic Partnerships
Cadence Joins OpenTitan as a Tools Partner to Accelerate Open-Source Silicon Security 2026-05-14 12:44:18 Ecosystem Landscape
UMC Announces Release of 14nm eHV FinFET Platform, Advancing Innovation in Next-Generation Smartphone Displays 2026-05-14 06:23:00 Foundries & Process Nodes
Fractile raises $220M to build the next generation of inference hardware 2026-05-13 14:50:00 Funding & Investments
Siemens democratizes EDA software access for European electronics industry through the Chips JU European Chips Design Platform (EuroCDP) project 2026-05-13 06:40:00 EDA & Design Tools
Siemens unveils AI-powered library characterization to accelerate semiconductor design 2026-05-13 06:34:52 EDA & Design Tools
Arteris Announces Financial Results for the First Quarter and Estimated Second Quarter and Updated Full Year 2026 Guidance 2026-05-13 06:17:42 Financials
FotoNation and SEMIFIVE Announce Strategic Collaboration for Turnkey Development of TriSilica Perceptual AI Chip Family Using Samsung Foundry 2026-05-13 05:53:28 Ecosystem Landscape
Apple-Intel Foundry Deal Could Reshape U.S. Chip Manufacturing 2026-05-12 13:56:51 Analysis & Insight
SiFive Sets New Bar for High-Performance RISC-V with Third-Generation Performance P550 and P570 IP 2026-05-12 13:23:00 IP Cores & Design
Imec demonstrates the first 3D implementation of a charge coupled device for AI memory applications 2026-05-12 11:37:50 Research Institutions
EXTOLL announces Availability of Industry's first 16G UCIe PHY IP in GlobalFoundries 22FDX/22FDX+ Ready for Customer Integration 2026-05-12 11:11:00 IP Cores & Design
Development of High-Precision Nonvolatile Analog Computing-in-Memory Technology Enabling Ultra-Low-Power AI Hardware 2026-05-12 06:12:00 Research Institutions