Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
2026-07-02 13:38:02
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Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
2026-07-02 13:38:02
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IP Cores & Design
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People & Leadership
TES offers a new DC-DC Split-Pi Boost-Buck Converter IP in X-FAB XT018-0.18µm BCD-on-SOI CMOS
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IP Cores & Design
Floadia Releases High-Performance Automotive Embedded Flash IP on Leading Foundry’s 90BCD Platform
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IP Cores & Design
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EDA & Design Tools
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Analysis & Insight
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Strategic Partnerships
ASICLAND Selected as SK hynix’s Partner for Next-Gen eSSD Development, Establishing a ‘K-Semiconductor Win-Win’ Model
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Commercial Deals
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Companies & Startups
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Commercial Deals
Infineon opens the world's largest fab for power semiconductors and analog/mixed-signal technologies in Dresden
2026-07-02 13:38:02
Foundries & Process Nodes
Tenstorrent Sets New Performance Records, Launches TT- Ascalon S, and Expands Across Japan
2026-07-02 07:30:52
IP Cores & Design
Chips&Media Signs APV codec IP Licensing Deal with North American Big Tech, Establishing the ‘Second Front’ Against Apple’s ProRes
2026-07-02 03:48:56
Commercial Deals
Chipsolve Technologies Appoints Balaji Kanigicherla as Chairman of the Board
2026-07-01 13:39:02
People & Leadership
OXMIQ Raises $35 Million to Scale OxCore™ Architecture
2026-07-01 13:26:43
Funding & Investments
SOC-E successfully showcases Time-Sensitive Networking (TSN) application for NGWS/FCAS Remote Carrier (Pillar 3)
2026-07-01 12:03:25
IP Cores & Design
Xiphera Strengthens Its Presence in Japan with the Appointment of Yasuhiro Okumura as Country Manager
2026-07-01 11:44:50
People & Leadership
TES offers a new DC-DC Split-Pi Boost-Buck Converter IP in X-FAB XT018-0.18µm BCD-on-SOI CMOS
2026-07-01 06:10:00
IP Cores & Design
Floadia Releases High-Performance Automotive Embedded Flash IP on Leading Foundry’s 90BCD Platform
2026-07-01 03:47:11
IP Cores & Design
Real Intent Meridian CDC with Microarchitectural Analysis (MA) Transforms Clock Domain Crossing Sign-Off
2026-06-30 18:19:42
EDA & Design Tools
BrainChip Announces Commercial Availability and Production Shipments of AKD1500 Neuromorphic Processors
2026-06-30 13:43:00
Technology & Integration
Allegro DVT plays a pivotal role in groundbreaking CHASSIS Automotive Base Die development
2026-06-30 13:26:07
Chiplet IP & Architectures
AI Component Capacity Squeeze and Foundry Output Cuts to Extend Mature-Node Price Increases in 2027
2026-06-30 11:55:44
Analysis & Insight
Xiphera Selected for ESA ARTES Project to Advance Secure High-Speed Satellite Communications
2026-06-30 11:49:00
IP Cores & Design
Amlogic Unveils A311Y3: Next-Generation 6nm SoC Built to Power the Edge AI Ecosystem
2026-06-30 11:31:00
Technology & Integration
CAST Introduces PSI5-HOST IP Core for Automotive Sensor Interfaces
2026-06-30 05:40:22
IP Cores & Design
StarFive and LECARC Forge Partnership to Co-Develop RISC-V Server CPUs and Seize New Opportunities in the Agentic AI Era
2026-06-29 11:52:35
Strategic Partnerships
ASICLAND Selected as SK hynix’s Partner for Next-Gen eSSD Development, Establishing a ‘K-Semiconductor Win-Win’ Model
2026-06-29 05:34:37
Commercial Deals
onsemi to Acquire Synaptics to Enable the Next Generation of Intelligent Systems for Physical AI
2026-06-26 08:55:47
Companies & Startups
EdgeAI Licensed Andes Technology CPU IP to Power Next-Generation Edge AI Neuromorphic Solution
2026-06-26 05:36:00
Commercial Deals