Chip Interfaces ApS
•
HQ:
Denmark
Industry , Silicon Proven, 32 Gbps per pin, backed by a portfolio of verification tools, PHY interoperability and integration.
- UCIe
Compare 32 D2D IP Listing from 19 vendors
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UCIe D2D Adapter & PHY Integrated IP
Chip Interfaces ApS• HQ: DenmarkA UCIe solution ready to support any protocol layer The D2D Adapter for UCIe combined with the UCIe PHY from a UCIe solution read…
- UCIe
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MSquare• HQ: China
The Die-to-Die interface is a functional block that provides a data interface between two chip dies within the same package.
- UCIe
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MSquare• HQ: China
The Die-to-Die interface is a functional block that provides a data interface between two chip dies in the same package.
- UCIe
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Cadence Design Systems, Inc.• HQ: USA
High-performance, low-latency PHY for D2D connectivity The UltraLink™ Die-to-Die (D2D) PHY enables SoC providers to deliver more …
- GlobalFoundries
- 12nm
- LP
- Silicon Proven
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<4Gbps Low Power D2D Interface in TSMC 16nm & 28nm
Certus Semiconductor• HQ: United StatesA
- TSMC
- 28nm
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Certus Semiconductor• HQ: United States
Custom die-to-die interface in 12/16nm process technology.
- Custom
- Silicon-Proven
- Immediate
- Numerous I/O Standards
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Neuron IP Inc.• HQ: Canada
The UCIe PHY & D2D Adapter IP portfolio includes 32Gbps UCIe- (UCIe-A) & Standard (UCIe-S) cores as per the latest UCIe v1.1 spec…
- UCIe
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D2D Controller addon for D2D SR112G PHY with CXS interface
Synopsys, Inc.• HQ: USAThe Die-to-Die Controller IP, optimized for latency, bandwidth, power, and area, enables efficient inter-die connectivity in serv…
- Custom
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Low Power D2D Interface in TSMC 16nm FFC/FFC+
Certus Semiconductor• HQ: United StatesA 600MBps Low Power Die-to-Die Interface in TSMC 16nm FFC/FFC+.
- TSMC
- 16nm
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Omni Design Technologies, Inc.• HQ: USA
The ODT-UCIE-UNI-TX-16GXX-16FFCT is a low power D2D transmitter IP in TSMC 16FFC process.
- TSMC
- 16nm
- FFC
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Omni Design Technologies, Inc.• HQ: USA
The ODT- UCIE-UNI-RX-16GXX-S8 is a low power D2D receiver IP in Samsung 8nm process.
- Samsung
- 8nm
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Chiplet Die-to-Die Interconnect IP Solution
M2Semi• HQ: ChinaHigh Performance Chiplet Die-to-Die Interconnect Total Solution
- Custom
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Universal Chiplet Interconnect Express PHY IP - GLOBALFOUNDRIES® 22FDX®
Racyics GmbH• HQ: GermanyUCIe PHY IP with X16 data width for standard package and up to 8 Gbit/s per pin data rate
- GlobalFoundries
- 22nm
- FDX
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Scalable RISC-V CPUs for Data Center, Automotive, and Intelligent Edge
Ventana Micro Systems Inc.• HQ: USAScalable RISC-V CPUs for Data Center, Automotive, and Intelligent Edge
- RISC-V
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Baya Systems• HQ: USA
The NeuraScale Scalable Switch Fabric is a WeaveIP™ system IP solution that is designed from the ground-up to provide non-blockin…
- Bus Fabric
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Ventana Micro Systems Inc.• HQ: USA
The second-generation high-performance RISC-V CPU delivers a major leap in compute capability, designed for deployment across dat…
- RISC-V
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Chip Interfaces ApS• HQ: Denmark
Industry , AXI5-Stream Solution for UCIe D2D Stacks The AXI-S Protocol Layer for UCIe is a protocol adapter layer between a Strea…
- UCIe
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Siemens Digital Industries Software• HQ: USA
Accelerated confidence in simulation-based verification of RTL designs with Universal Chiplet Interconnect Express (UCIe) interfa…
- Verification IP
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Blue Cheetah Analog Design, Inc.• HQ: USA
BlueLynx PHY IP is one side of a die-to-die parallel interface delivered as a single GDS Hard IP and a single RTL Soft IP.
- Custom