CDM Dependence on Device Capacitance
This blog will focus on what happens during the CDM pulse itself, and will show how the pulse properties change as a function of DUT to Field Plate capacitance.
Vendor:
Certus Semiconductor
Category:
Custom
2Gbps Low Power D2D Interface
Custom die-to-die interface in 12/16nm process technology.
Overview
Custom die-to-die interface in 12/16nm process technology. The I/O cells are defined as TX only, and RX only and have two modes of operation, standard full rail-to-rail swing, or a custom low-noise pseudo-differential interface. RX cells have a weak pull-down feature.
Key features
- Core Device: 0.8V
- I/O Device: 1.8V Standard
- Core: Uses SVT only
- BEOL: M8 and below
- PAD: Flipchip/Die to Die packaging only, no wire-bond option.
- Cell Dimension: 50um x 28.06um
- VDD: 0.8V±10%, 0.7V/0.65V
- Temperature: -40C to 125C
- Operational Bit Rate: 2GBps per signal (MAX is 3.5GBps over corners)
- ESD: ESD testing of the I/O will never occur directly, but we need to sufficiently mitigate die-to-die CDM stresses and assembly issues.
What’s Included?
- Verilog Models for all I/O, behavioral, and stubs.
- LEF's
- CDL netlists for DRC and LVS
- GDS
- IBIS
- Liberty TIming Models
- User Guide and Documentation
Specifications
Identity
Part Number
12/16nm D2D Interface
Vendor
Certus Semiconductor
Type
Silicon IP
Provider
HQ:
United States
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Frequently asked questions about Custom Die-to-Die IP cores
What is 2Gbps Low Power D2D Interface?
2Gbps Low Power D2D Interface is a Custom IP core from Certus Semiconductor listed on Semi IP Hub.
How should engineers evaluate this Custom?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Custom IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.