40G UltraLink D2D PHY
High-performance, low-latency PHY for D2D connectivity
Overview
High-performance, low-latency PHY for D2D connectivity
The Cadence UltraLink™ Die-to-Die (D2D) PHY enables SoC providers to deliver more customized solutions that offer higher performance and yields while also shortening development cycles and reducing costs through greater IP reuse.
It is a mature solution that is silicon proven in multiple foundries and different process nodes.
Key features
- Innovative mixed-signal architecture to achieve high bandwidth, ultra low latency and low power
- Flexible data rate from 20Gbps to 40Gbps
- Built-in self-test features to ensure “known good die”
- Interoperable between different technology nodes and foundries
- Easy routing and straightforward integration
- Achieves better than 10-15 bit error rate (BER) without requiring forward error correction (FEC)
- Integrated scrambling and lane de-skew functionality
- Supports -40ºC to 125ºC industrial temperature range
Block Diagram
Benefits
- Ultra-Low Latency: Optimized for latency-sensitive applications
- High Performance: 40Gbps wire speed delivers up to 1Tbps/mm unidirectional bandwidth
- Cost Effective: Supports multi-chip module on organic substrates
Silicon Options
| Foundry | Node | Process | Maturity |
|---|---|---|---|
| GlobalFoundries | 12nm | LP | Silicon Proven |
Specifications
Identity
Files
Note: some files may require an NDA depending on provider policy.
Provider
Learn more about UltraLink IP core
Frequently asked questions about UltraLink IP cores
What is 40G UltraLink D2D PHY?
40G UltraLink D2D PHY is a UltraLink IP core from Cadence Design Systems, Inc. listed on Semi IP Hub. It is listed with support for globalfoundries Silicon Proven.
How should engineers evaluate this UltraLink?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this UltraLink IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.