Die-to-Die (D2D) Interface for Chiplet Application
Compliant with the UCIe Specification Revision 1.1
Overview
The UCIe PHY IP is a market-leading, ultra low-power, and low-latency interface IP for high-bandwidth connections between two dies that are on the same substrate. The PHY IP implements a wide-parallel and forwarded-clock PHY interface for multi-channel interconnections at data rate up to 24 Gbps per pin.
The PHY IP is configurable to support the leading standards in the industry Universal Chiplet Interconnect Express (UCIe)--providing customers a Die-to-Die (D2D) solution that is compliant with industry standards.
Key features
- Compliant with the UCIe Specification Revision 1.1
- Supports 4, 8, 12, 16, and 24 GT/s data rates
- Self-calibrating and training
- Supports muti-module (1, 2, or 4) design
- Sideband channel for initialization and parameter exchange
- Built-in self-test (BIST), internal loopback, and external PHY-to-PHY link test
- On-chip calibration for termination impedance
- Flexible configuration: 16 RX and TX pins per module (standard package)
- Supports a minimum output driver voltage of 0.5 V
- Junction temperature range: -40°C to 125°C
- Package type: standard package
- Power consumption: < 1.2 pJ/bit @ 16 Gbps (standard package)
Block Diagram
Specifications
Identity
Standards & Interfaces
Files
Note: some files may require an NDA depending on provider policy.
Provider
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Frequently asked questions about UCIe IP cores
What is Die-to-Die (D2D) Interface for Chiplet Application?
Die-to-Die (D2D) Interface for Chiplet Application is a UCIe IP core from VeriSilicon Microelectronics (Shanghai) Co., Ltd. listed on Semi IP Hub.
How should engineers evaluate this UCIe?
Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this UCIe IP.
Can this semiconductor IP be compared with similar products?
Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.