USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP, Silicon Proven in SMIC 14SF+
The combo PHY consist of Peripheral Component Interconnect Express (PCIe) compliant with PCIe 3.0 Base Specification with support…
- SMIC
- 14nm
- SF+
- In Production
T2M GmbH is the leading Global Technology Company supplying state of the art complex semiconductor connectivity IPs and KGDs, enabling the creation of complex connected devices for Mobile, IoT and Wearable markets.
T2M's unique SoC White Box IPs are the design database of mass production RF connectivity chips supporting standards including Wifi, BT, BLE, Zigbee, NFC, LTE, GSM, GNS. They are available in source code as well as KGD for SIP / modules.
With offices in USA, Europe, China, Taiwan, South Korea, Japan, Singapore and India, T2M’s highly experienced team provides local support, accelerating product development and Time 2 Market.
USB 3.0/ PCIe 3.0/ SATA 3.0 Combo PHY IP, Silicon Proven in SMIC 14SF+
The combo PHY consist of Peripheral Component Interconnect Express (PCIe) compliant with PCIe 3.0 Base Specification with support…
DVB-S2/S/T2/T/C Combo Demodulator IP (Silicon Proven)
The is a single-chip DVB-T, T2, C, S and S2 demodulator IP core extratced from production chip and silicon proven IP core.
GbE (10/100 Base-T) PHY IP, Silicon Proven UMC 40LP
An IEEE 802.3u compliant single-port Ethernet physical layer transceiver with low power consumption for 10BASE-Te and 100BASE-TX …
DDR4/ LPDDR4/ DDR3L PHY IP - 1866Mbps (Silicon Proven in TSMC 28HPC+)
The LPDDR4/ DDR4/ DDR3L Combo PHY IP offers low latency and supports throughput of up to 1866Mbps.
Display Port v1.4 Tx PHY & Controller IP, Silicon Proven in TSMC 40LP
Data rates for the DisplayPort transmitter PHY version 1.4 range from 1.62Gbps (RBR) to 5.4Gbps (HBR2).
USB 3.1 Gen1/Gen2 PHY IP, Silicon Proven in TSMC 28HPC+
This PHY IP supports both USB 3.1 Gen1 & Gen2.
PCIe 4.0 Serdes PHY IP, Silicon Proven in TSMC 28HPCP
With compatibility for PIPE 4.4 interface protocol, this Peripheral Component Interconnect Express (PCIe) x4 PHY complies with PC…
DDR4/ LPDDR4/ DDR3L PHY IP - 3200Mbps (Silicon Proven in TSMC 12FFC)
The DDR4/ DDR3L/ LPDDR4 Combo PHY IP provides low latency and enables up to 3200Mbps throughput.
H.264/265 Video Encoder and Decoder IP
The Hardware Encoder Video Accelerator (HEVA), supports HEVC encoding low complexity with a flexible architecture targeting at le…
Local Interconnect Network (LIN) Soft Controller IP
The DLIN is a soft core of the Local Interconnect Network (LIN).
Convolutional FEC codes are very popular because of their error correction capability and are especially suited for correcting ra…
In Digital video broadcasting for digital transmission for satellite applications, a FEC sub-system is needed.
This design is a ISDB-S3-LDPC-BCH Decoder IP, ready to license, verified and packaged, and supplied as a portable and synthesizab…
XPHY Low power Chip to Chip SerDes IP, Silicon Proven in ST 28FDSOI
These IPs are targeted at applications requiring high speed, high bandwidth, low-power consumption, and low-latency interfaces.
V-by-One/LVDS Tx IP, Silicon Proven in GF 22FDX
Based on internal equipment connections, the V-by-One® HS technology aims to transmit video signals at high data rates.
V-by-One/LVDS Rx IP, Silicon Proven in GF 22FDX
The V-by-One® HS technology aims to transmit video signals at a high data rate using internal equipment connections.
V-by-One Rx IP, Silicon Proven in SMIC 40LL
The V-by-One HS technology aims to transmit video signals at a high data rate using internal equipment connections.
V-by-One Tx IP, Silicon Proven in SMIC 40LL
V-by-One HS technology targets a high-speed data transmission of video signals based on the internal connection of equipment.
LVDS/FPD Link IP, Silicon Proven in GF 28LPe
A physical layer IP for LVDS transmitter.
LVDS/FPD Link IP, Silicon Proven in GF 65/55LPe
A transmitter for LVDS with a physical layer IP.