Vendor: T2M GmbH Category: Multi-Protocol PHY

XPHY Low power Chip to Chip SerDes IP, Silicon Proven in ST 28FDSOI

These IPs are targeted at applications requiring high speed, high bandwidth, low-power consumption, and low-latency interfaces.

Overview

These IPs are targeted at applications requiring high speed, high bandwidth, low-power consumption, and low-latency interfaces.

Key features

  • Low Power Chip-to-Chip SERDES
  • From 10Gb/s to 11Gb/s
  • Technology: 28FDSOI 8ML & 10ML
  • Platform: 1 Data Slice and 1 Clock Slices
  • RX: AC or DC coupling with low-power CTLE
  • TX: Power-optimized resistive bridge driver
  • Optimized for Low Power Chip-to-Chip SERDES Applications

Block Diagram

XPHY Low power Chip to Chip SerDes IP in 28FDSOI block diagram

Benefits

  • Ultra low voltage operation
  • Optimized for low power Chip to Chip SERDES Applications

Applications

  • IOT
  • Wearables

Specifications

Identity

Part Number
XPHY Low power Chip to Chip SerDes IP in 28FDSOI
Vendor
T2M GmbH
Type
Silicon IP

Files

Product Sheet Download

Note: some files may require an NDA depending on provider policy.

Provider

T2M GmbH
HQ: Germany

Learn more about Multi-Protocol PHY IP core

Three Design Aspects you shouldn't miss while building an NB-IoT Protocol Stack

It is very important that the design aspects of the NB-IoT device protocol stack ensure low module cost and low energy consumption. This is required to match the industry expected module costs. This paper outlines some of the NB-IoT Protocol stack specification flexibilities and generic design aspects that are to be considered to meet the above requirements, especially with reference to LTE.

Frequently asked questions about Multi-Protocol PHY IP cores

What is XPHY Low power Chip to Chip SerDes IP, Silicon Proven in ST 28FDSOI?

XPHY Low power Chip to Chip SerDes IP, Silicon Proven in ST 28FDSOI is a Multi-Protocol PHY IP core from T2M GmbH listed on Semi IP Hub.

How should engineers evaluate this Multi-Protocol PHY?

Engineers should review the overview, key features, supported foundries and nodes, maturity, deliverables, and provider information before shortlisting this Multi-Protocol PHY IP.

Can this semiconductor IP be compared with similar products?

Yes. Buyers can compare this product with similar semiconductor IP cores or IP families based on category, provider, process options, and structured technical specifications.

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